Protective member forming apparatus

Patent metadata

Field	Value
Publication number	US-10916459-B2
Application number	US-201916527692-A
Country	US
Kind code	B2
Filing date	Jul 31, 2019
Priority date	Aug 6, 2018
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

A holding table for holding a wafer includes plural pins, and a wafer holding surface includes the tips of the plural pins. Therefore, small dust enters between the pins and thus is less readily left between the wafer holding surface and the wafer. Therefore, when the wafer is sucked and held, a gap is less readily made between the wafer holding surface and the wafer. Thus, the occurrence of the situation in which the wafer is held in a waving state is suppressed. For this reason, when a liquid resin is pushed to spread over the lower surface of the wafer, an air bubble enters less readily between the liquid resin and the wafer. This can suppress entry of the air bubble in a protective member obtained by curing the liquid resin.

First claim

What is claimed is:

1. A protective member forming apparatus comprising:
a holding table having a workpiece holding surface that sucks and holds an upper surface of a workpiece;
a stage that is disposed opposed to the workpiece holding surface and holds a lower surface of a film;
resin supply means that supplies a liquid resin onto an upper surface of the film held by the stage;
expanding means that pushes and spreads the liquid resin on the upper surface of the film by a lower surface of the workpiece held by the workpiece holding surface by causing the holding table to move in such a direction as to come closer to the stage; and
curing means that cures the liquid resin pushed to spread and forms a protective member, wherein
the holding table includes
a base with a flat plate shape,
an annular wall on a peripheral edge of the base, the annular wall defines a suction recess part;
a plurality of pins disposed upright in the suction recess part and extending in a downward direction from a lower surface of the base and gaps formed between the plurality of pins, wherein the annular wall surrounds the plurality of pins and has a lower surface with the same height as tips of the pins, and
a suction path that penetrates the base and communicates with a suction source inside the annular wall,

wherein when the wafer comes into contact with the wafer holding surface and the plurality of pins are covered by the upper surface of the workpiece, the gaps between the plurality of pins are hermetically sealed and set to a negative pressure by a suction force of the suction source to thereby hold the wafer by the suction force of the wafer holding surface.

2. A protective member forming apparatus comprising:
a holding table having a holding surface that sucks and holds an upper surface of a wafer;
a stage that is disposed opposed to the holding surface and holds a lower surface of a film;
resin supply means that supplies a liquid resin onto an upper surface of the film held by the stage;
expanding means that pushes and spreads the liquid resin on the upper surface of the film by a lower surface of the wafer held by the holding surface by causing the holding table to move in such a direction as to come closer to the stage; and
curing means that cures the liquid resin pushed to spread and forms a protective member,
a ring frame,
an adhesive tape that closes an opening of the ring frame and has a peripheral part stuck to the ring frame, wherein the wafer is stuck to a part inside the opening in the adhesive tape, and
the protective member is formed by sucking and holding an upper surface of the wafer stuck to the adhesive tape by the workpiece holding surface and pushing and spreading the liquid resin on the film by a lower surface of the adhesive tape stuck to a lower surface of the wafer,
wherein the holding table includes:
a base with a flat plate shape,
a plurality of pins disposed upright in a downward direction on a lower surface of the base,
an annular wall that surrounds the plurality of pins and has a lower surface with the same height as tips of the pins, and
a suction path that penetrates the base and communicates with a suction source inside the annular wall,
wherein when the wafer comes into contact with the wafer holding surface and the plurality of pins are covered by the upper surface of the wafer, gaps between the plurality of pins are hermetically sealed and set to a negative pressure by a suction force of the suction source to thereby hold the wafer by the suction force of the wafer holding surface.

3. The protective member forming apparatus according to claim 2 , wherein the adhesive tape includes a tape base having a first surface and a second surface on an opposite side to the first surface and a ring-shaped adhesive disposed on the first surface of the tape base, and the first surface of the tape base on which the ring-shaped adhesive is not disposed is brought into tight contact with the wafer when the protective member is formed.

4. The protective member forming apparatus according to claim 2 , wherein said annular wall forms a suction recess part, and said plurality of pins extend from a bottom surface of said suction recess part.

Assignees

• Disco Corp

Inventors

• Namioka Shinichi

Classifications

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P14/6508

  by exposure to a liquid · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title