Plasma processing apparatus and measurement method
US-9658106-B2 · May 23, 2017 · US
Wafer drying equipment and method thereof
US10916452B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10916452-B2 |
| Application number | US-201816232039-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 25, 2018 |
| Priority date | Dec 4, 2018 |
| Publication date | Feb 9, 2021 |
| Grant date | Feb 9, 2021 |
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- Title
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- Abstract
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Abstract
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A wafer drying equipment includes a base, a casing and a microwave generator. The base is configured to support a wafer. The casing forms a chamber with the base. The chamber is configured to accommodate the wafer. The casing has an exhaust vent away from the base. The microwave generator is disposed on the casing and is configured to emit a microwave to the chamber.
First claim
Opening claim text (preview).
What is claimed is: 1. A wafer drying equipment, comprising: a base configured to support a wafer; a casing forming a chamber with the base, the chamber being configured to accommodate the wafer, the casing having an exhaust vent away from the base; and a microwave generator disposed in direct contact with an outer surface of the casing and configured to emit a microwave to the wafer in the chamber. 2. The wafer drying equipment of claim 1 , wherein the microwave generator is disposed outside the casing and the casing has a plurality of through holes configured to allow the microwave to penetrate through. 3. The wafer drying equipment of claim 1 , wherein a quantity of the microwave generator is plural and the microwave generators are distributed around the chamber. 4. The wafer drying equipment of claim 1 , further comprising: a rotator connected with the base and configured to rotate the base. 5. The wafer drying equipment of claim 4 , wherein a rotating speed of the base is about 10 rpm. 6. The wafer drying equipment of claim 1 , wherein the casing is made of metal. 7. The wafer drying equipment of claim 1 , wherein the exhaust vent is in a form of plurality of through holes.
Assignees
Inventors
Classifications
mainly by radiation · CPC title
- H10P72/0408Primary
for drying · CPC title
Electromagnetic heating, e.g. induction heating or heating using microwave energy · CPC title
using electric heating (F26B23/10 takes precedence) · CPC title
on or in moving dishes, trays, pans, or other mainly-open receptacles · CPC title
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Frequently asked questions
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- What does patent US10916452B2 cover?
- A wafer drying equipment includes a base, a casing and a microwave generator. The base is configured to support a wafer. The casing forms a chamber with the base. The chamber is configured to accommodate the wafer. The casing has an exhaust vent away from the base. The microwave generator is disposed on the casing and is configured to emit a microwave to the chamber.
- Who is the assignee on this patent?
- Nanya Technology Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0408. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).