Apparatus for heat transfer, utilizing the Joule Thomson (JT) effect, for crowning upon heat-emitting devices

US10914495B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10914495-B2
Application numberUS-201715707898-A
CountryUS
Kind codeB2
Filing dateSep 18, 2017
Priority dateSep 18, 2017
Publication dateFeb 9, 2021
Grant dateFeb 9, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments of the present disclosure generally relate to heat transferring apparatuses and methods. The apparatus and methods utilize the Joule-Thomson effect to remove heat from a heat source to facilitate cooling of the heat source. In one example, an apparatus receives heat from an object to be cooled. The received heat is used to pressurize a fluid. The pressurized fluid is depressurized through a venturi using vapor pressure as a driving force, thus cooling the fluid.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat transfer device, comprising: a body; a lid assembly positioned on the body and defining an internal volume of the body; an internal container located within the body, an outer wall of the internal container spaced apart from an inner wall of the body, the internal container including a bowl having an internal volume therein, the internal volume of the bowl separated from the internal volume of the body by a sealing member positioned over an opening formed through a sidewall of the bowl, the opening including a venturi; and a puncturing device positioned to rupture the sealing member. 2. The heat transfer device of claim 1 , further comprising a plurality of heat sinks extending between the bowl and the body. 3. The heat transfer device of claim 1 , further comprising a recirculation system, the recirculation system having a first end coupled to the body and a second end coupled to the lid assembly. 4. The heat transfer device of claim 3 , wherein the recirculation system includes a plurality of recirculation paths. 5. The heat transfer device of claim 1 , wherein the puncturing device includes a spring-loaded needle. 6. The heat transfer device of claim 5 , wherein the puncturing device includes a stop plate coupled to the spring-loaded needle, the stop plate configured to engage the bowl of the internal container. 7. The heat transfer device of claim 1 , wherein the sealing member seals the opening formed through a sidewall of the bowl. 8. The heat transfer device of claim 7 , wherein the opening is in fluid communication with a venturi. 9. The heat transfer device of claim 1 , wherein the puncturing device includes a plurality of puncturing devices radially spaced about the internal container. 10. The heat transfer device of claim 9 , wherein each of the plurality of puncturing devices is aligned with an opening formed through a sidewall of the bowl. 11. The heat transfer device of claim 10 , wherein the internal volume of the bowl is partitioned into wedge-shaped compartments. 12. The heat transfer device of claim 1 , wherein the internal container is positioned concentrically with respect to the body. 13. A heat transfer device, comprising: a body; a lid assembly positioned on the body and defining an internal volume of the body; an internal container located within the body, the internal container including a bowl having an internal volume therein, the internal volume of the bowl separated from the internal volume of the body by a plurality of sealing members positioned over openings formed through a sidewall of the bowl, the openings each including a venturi; and a plurality of puncturing devices radially disposed around the body and aligned with each opening to rupture respective sealing members. 14. The heat transfer device of claim 1 , further comprising a venturi in fluid communication with the opening formed in the bowl when the sealing member is in a ruptured state. 15. A method of cooling an object, comprising: positioning a heat transfer device adjacent to the object, the heat transfer device including, a body, a lid disposed on the body, and an internal container located within the body, the internal container including a sidewall opening comprising a venturi; transferring heat from the object to fluid housed in the heat transfer device, thereby increasing a temperature and a pressure of the fluid; rupturing a sealing member formed over the sidewall opening of the internal container with a puncturing device to release the heated fluid and allowing the fluid to expand and cool. 16. The method of claim 15 , wherein the heated fluid is released through the venturi. 17. The method of claim 15 , wherein the puncturing device is a needle. 18. The method of claim 15 , wherein the released fluid is recirculated within the heat transfer device. 19. The method of claim 15 , wherein the internal container includes a bowl, and the opening is formed in the bowl.

Assignees

Inventors

Classifications

  • using solidified gases, e.g. carbon-dioxide snow · CPC title

  • using liquefied gases, e.g. liquid air {(for cooling semiconductor devices H10W40/305)} · CPC title

  • Quick cooling · CPC title

  • Arrangement or mounting of refrigeration units with respect to devices {or objects to be refrigerated, e.g. infrared detectors} · CPC title

  • F25B9/02Primary

    using Joule-Thompson effect; using vortex effect · CPC title

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What does patent US10914495B2 cover?
Embodiments of the present disclosure generally relate to heat transferring apparatuses and methods. The apparatus and methods utilize the Joule-Thomson effect to remove heat from a heat source to facilitate cooling of the heat source. In one example, an apparatus receives heat from an object to be cooled. The received heat is used to pressurize a fluid. The pressurized fluid is depressurized t…
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification F25B9/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Feb 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).