Wave absorbing member attachable to paddle and plating apparatus including wave absorbing member

US10914020B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10914020-B2
Application numberUS-201816216852-A
CountryUS
Kind codeB2
Filing dateDec 11, 2018
Priority dateDec 15, 2017
Publication dateFeb 9, 2021
Grant dateFeb 9, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction and a front end portion designed to be tapered toward an end from the body portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid, the wave absorbing member comprising: a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction; and a front end portion designed to be tapered toward an end from the body portion wherein the tapered portion is configured to cut the liquid surface when moving in the horizontal direction, wherein the claimed front end portion is configured to cut the liquid surface when moving in the horizontal direction by providing a portion the front end portion above the liquid surface and a portion of the front end portion below the liquid surface. 2. The wave absorbing member according to claim 1 , wherein the front end portion is inclined at an acute angle with respect to a horizontal plane with the wave absorbing member being attached to the paddle. 3. The wave absorbing member according to claim 1 , further comprising a guide portion that is formed on both sides of the thin plate shaped body portion and extends in the horizontal direction as a whole. 4. The wave absorbing member according to claim 3 , wherein the guide portion includes a linear portion. 5. The wave absorbing member according to claim 3 , wherein the guide portion includes a curved portion. 6. The wave absorbing member according to claim 3 , wherein the guide portion includes a first portion extending upward from the liquid surface and a second portion extending downward to the liquid surface. 7. The wave absorbing member according to claim 3 , wherein a plurality of the guide portions is provided. 8. A paddle that is moveable in a horizontal direction to stir liquid, the paddle comprising the wave absorbing member according to claim 1 . 9. A plating apparatus comprising: a plating tank that stores a plating solution; and the paddle according to claim 8 configured to stir the plating solution stored in the plating tank.

Assignees

Inventors

Classifications

  • Current shielding devices · CPC title

  • Stirrers with additional elements mounted on the stirrer, for purposes other than mixing · CPC title

  • Mixing semiconducting materials, e.g. during semiconductor or wafer manufacturing processes · CPC title

  • Stirrers constructions · CPC title

  • Preventing generation of dust or dirt; Sieves; Filters (B01F35/145, B01F35/43 take precedence) · CPC title

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What does patent US10914020B2 cover?
To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liqui…
Who is the assignee on this patent?
Ebara Corp
What technology area does this patent fall under?
Primary CPC classification C25D21/10. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).