Oxazine compound, composition and cured product

Patent metadata

Field	Value
Publication number	US-10913725-B2
Application number	US-201615781843-A
Country	US
Kind code	B2
Filing date	Nov 8, 2016
Priority date	Dec 16, 2015
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve the object.

First claim

The invention claimed is:

1. An oxazine compound comprising:
a structure of General Formula (1),
wherein General Formula (1) has at least two or more functional groups R 1 represented by General Formula (4) or (5):
X Y) n   (1)

in Formula (1), n represents an integer of 2 to 4, Y's are each independently a structure represented by General Formula (2), and X is represented by any one of General Formulae (3);

in Formula (2), ring A represents an unsubstituted aromatic ring or a substituted aromatic ring consisting of one or more of the functional groups R 1 , and a 1 represents a bonding position to X in General Formula (1);

in Formula (3), Ar 1 to Ar 6 each independently represent a substituted or unsubstituted aryl group, Ar 7 represents a substituted or unsubstituted arylene group, n 2 represents an integer from 2 to 4, n 3 represents an integer of 1 or 2, and Z 1 , Z 2 , and Z 3 each independently represent any one of a single bond, a nitrogen atom, an oxygen atom, an alkylene group, an arylene group, a carbonyl group, an ester group, an amide group, an imino group, an azo group, a sulfide group, a sulfone group, and a group consisting of these groups in combination;

in Formula (4), V 1 , V 2 , and Q 1 each independently represent a single bond or a divalent linking group, R 2 , R 3 , and R 4 represent a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 2 represents a bonding point to General Formula (1);

in Formula (5), n 4 represents an integer of 2 to 6, V 3 and V 4 each independently represent a single bond or a divalent linking group, Q 2 represents a linking group having a valence of n 4 +1, R 5 , R 6 , and R 7 represent a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 3 represents a bonding point to General Formula (1).

2. The oxazine compound according to claim 1 which is represented by General Formula (1-1) or (1-2):

in Formulae (1-1) and (1-2), n's each independently represent an integer of 2 to 4, Y's are each independently a structure represented by General Formula (2), X is represented by any one of General Formulae (3), and R 1 's each independently represent a group of Formula (4) or (5).

3. The oxazine compound according to claim 1 , wherein the aromatic ring of the ring A is a benzene ring or a naphthalene ring.

4. A composition comprising the oxazine compound according to claim 1 .

5. The composition according to claim 4 , further comprising a reactive compound.

6. The composition according to claim 5 , wherein the reactive compound is a compound having a maleimide group.

7. The composition according to claim 4 , further comprising a filler.

8. The composition according to claim 4 , further comprising a fibrous substrate.

9. A cured product, which is obtained by curing the composition according to claim 4 .

10. A laminate comprising:
a base material; and
a layer of the cured product according to claim 9 .

11. A composition for a heat-resistant material, comprising the composition according to claim 4 .

12. A heat-resistant member comprising the cured product according to claim 9 .

13. A composition for an electronic material, comprising the composition according to claim 4 .

14. An electronic member comprising the cured product according to claim 9 .

15. A semiconductor sealing material comprising the composition according to claim 4 .

16. A prepreg comprising the composition according to claim 8 .

17. A circuit board comprising the prepreg according to claim 16 and a copper foil layer.

18. A build-up substrate comprising the laminate of claim 10 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Otsu Masato
• Shimono Tomohiro
• Arita Kazuo
• Yamaguchi Junji

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• C07D265/14 Primary

  condensed with one six-membered ring · CPC title

• C08L61/34

  Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20 · CPC title