Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group

Patent metadata

Field	Value
Publication number	US-10912200-B2
Application number	US-201815982240-A
Country	US
Kind code	B2
Filing date	May 17, 2018
Priority date	Dec 21, 2015
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive contact sheet group positioned on the surface of the substrate, where a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.

First claim

The invention claimed is:

1. A printed circuit board, comprising:
a substrate; and
an electro-conductive contact sheet group;
wherein the electro-conductive contact sheet group is positioned on a surface of the substrate, a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.

2. The printed circuit board according to claim 1 , wherein a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group.

3. The printed circuit board according to claim 1 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and a part of the electro-conductive wirings positioned on the surface of the substrate is overlaid with the solder resist.

4. The printed circuit board according to claim 3 , wherein a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group.

5. The printed circuit board according to claim 1 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and the electro-conductive wirings positioned on the surface of the substrate are not overlaid with the solder resist.

6. The printed circuit board according to claim 1 , wherein a width of the gap between the solder resist and the electro-conductive contact sheet group is in a range between 0.6 mm to 1 mm.

7. The printed circuit board according to claim 6 , wherein the width of the gap between the solder resist and the electro-conductive contact sheet group is almost 0.8 mm.

8. The printed circuit board according to claim 6 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets.

9. The printed circuit board according to claim 6 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets.

10. The printed circuit board according to claim 1 , wherein the solder resist is liquid photoinduced solder resist.

11. The printed circuit board according to claim 10 , wherein the liquid photoinduced solder resist is green liquid photoinduced solder resist.

12. An optical module, comprising:
an optical transmitter;
an optical receiver; and
a printed circuit board, wherein the printed circuit board comprises a substrate, and an electro-conductive contact sheet group;
wherein the electro-conductive contact sheet group is positioned on a surface of the substrate, a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.

13. The optical module according to claim 12 , wherein a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group.

14. The optical module according to claim 12 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and a part of the electro-conductive wirings is overlaid with the solder resist.

15. The optical module according to claim 14 , wherein a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group.

16. The optical module according to claim 12 , wherein the printed circuit board further comprises electro-conductive wirings positioned on the surface of the substrate, and the electro-conductive wirings are not overlaid with the solder resist.

17. The optical module according to claim 12 , wherein a width of the gap between the solder resist and the electro-conductive contact sheet group is in a range between 0.6 mm to 1 mm.

18. The optical module according to claim 17 , wherein the width of the gap between the solder resist and the electro-conductive contact sheet group is 0.8 mm.

19. The optical module according to claim 17 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets.

20. The optical module according to claim 17 , wherein the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets having different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets.

Assignees

• Hisense Broadband Multimedia Technology Co Ltd
• Hisense Usa Cororation
• Hisense Int Co Ltd
• Hisense Usa Corp

Inventors

• Zhao Wei
• Cui Wei
• Yu Lin

Classifications

• H05K1/117 Primary

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• H05K3/3452

  Solder masks · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2201/0137

  Materials · CPC title