High efficiency LEDs and LED lamps

Patent metadata

Field	Value
Publication number	US-10910522-B2
Application number	US-201916358888-A
Country	US
Kind code	B2
Filing date	Mar 20, 2019
Priority date	Jun 27, 2009
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.

First claim

What is claimed is:

1. A lighting system comprising:
an electrically insulating carrier having a plurality of conductive elements disposed thereon;
disposed over the carrier, a light-emitting array comprising a plurality of light-emitting strings, each light-emitting string comprising a plurality of light-emitting diodes (LEDs) electrically connected in series, each LED having at least two electrical contacts, wherein each electrical contact is electrically connected to a conductive element by an electrical connection comprising a solder or a conductive adhesive,
wherein the conductive elements comprise aluminum.

2. The system of claim 1 , wherein at least one first light-emitting string emits light having a color, color temperature, intensity, efficiency, color rendering index, or spectral light distribution different from a color, color temperature, intensity, efficiency, color rendering index, or spectral light distribution of at least one second light-emitting string.

3. The system of claim 1 , further comprising a light-conversion material disposed in or over at least one of the LEDs, wherein the conductive elements are reflective to at least one of (i) a wavelength of light emitted by at least one of the LEDs or (ii) a wavelength of light emitted by the light-conversion material.

4. The system of claim 1 , further comprising, electrically connected to the plurality of light-emitting strings, electrical circuitry for selectively turning off various ones of the light-emitting strings, thereby dimming a light output of the light-emitting array, without altering a level of drive current supplied to the LEDs.

5. The system of claim 1 , further comprising an array of optical elements each associated with at least one LED, the array of optical elements at least one of focusing or shaping light from the LEDs to a desired illumination pattern.

6. The system of claim 1 , wherein the conductive elements are reflective to a wavelength of light emitted by at least one of the LEDs.

7. The system of claim 1 , wherein the electrically insulating carrier comprises a polymeric material.

8. The system of claim 1 , wherein the electrically insulating carrier is flexible.

9. The system of claim 1 , wherein (i) the plurality of conductive elements comprises a plurality of first conductive elements and a plurality of second conductive elements, (ii) each electrical contact is electrically connected to a different first conductive element by an electrical connection comprising a solder or a conductive adhesive, and (iii) the lighting system comprises at least two connectors each electrically coupled to a different second conductive element, the second conductive elements providing power to the light-emitting array.

10. The system of claim 9 , wherein the at least two connectors comprise snap contacts.

11. The system of claim 1 , further comprising a metal layer disposed between the conductive elements and the electrical contacts of the LEDs.

12. The system of claim 11 , wherein the metal layer comprises copper.

13. The system of claim 1 , wherein at least one LED comprises a packaged LED.

14. The system of claim 13 , wherein the packaged LED comprises a light-conversion material.

15. The system of claim 1 , wherein at least one LED comprises a bare-die LED.

16. The system of claim 15 , further comprising a light-conversion material disposed over at least a portion of the bare-die LED.

17. The system of claim 1 , further comprising a transparent encapsulant covering at least a portion of the light-emitting array.

18. The system of claim 17 , wherein the encapsulant comprises a shell over at least a portion of the light-emitting array.

19. The system of claim 17 , wherein the encapsulant non-conformally coats at least a portion of the light-emitting array.

20. The system of claim 17 , wherein the encapsulant conformally coats at least a portion of the light-emitting array.

21. A lighting system comprising:
an electrically insulating polymeric carrier having a plurality of conductive elements disposed thereon;
disposed over the carrier, a light-emitting array comprising a plurality of light-emitting strings, each light-emitting string comprising a plurality of light-emitting diodes (LEDs) electrically connected in series, each LED having at least two electrical contacts, wherein each electrical contact is electrically connected to a conductive element by an electrical connection comprising a solder;
disposed on the carrier, circuitry for controlling current supplied to the LEDs; and
at least one power source for providing power to the light-emitting strings,
wherein (i) the conductive elements comprise aluminum and (ii) the LEDs emit white light.

22. The system of claim 21 , wherein at least one first light-emitting string emits light having a color, color temperature, intensity, efficiency, color rendering index, or spectral light distribution different from a color, color temperature, intensity, efficiency, color rendering index, or spectral light distribution of at least one second light-emitting string.

23. The system of claim 21 , further comprising a transparent encapsulant covering at least a portion of the light-emitting array.

24. The system of claim 21 , further comprising a metal layer disposed between the conductive elements and the electrical contacts of the LEDs.

25. The system of claim 24 , wherein the metal layer comprises copper.

Assignees

• Tischler Michael A
• Odnoblyudov Vladimir
• Keogh David
• Cooledge Lighting Inc

Inventors

• Tischler Michael A
• Odnoblyudov Vladimir
• Keogh David

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title