High efficiency LEDs and LED lamps

Patent metadata

Field	Value
Publication number	US-10281091-B2
Application number	US-201815938336-A
Country	US
Kind code	B2
Filing date	Mar 28, 2018
Priority date	Jun 27, 2009
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.

First claim

What is claimed is:

1. A lighting system comprising:
a thermally conductive carrier having a plurality of conductive elements disposed thereover;
disposed over the carrier, a light-emitting array comprising a plurality of electrically connected unpackaged light-emitting diodes (LEDs), each unpackaged LED having at least two electrical contacts, wherein at least some of the electrical contacts are each electrically connected to a conductive element; and
a light-conversion material disposed over the unpackaged LEDs for absorption of at least a portion of light emitted from the unpackaged LEDs and emission of converted light having a different wavelength, converted light and unconverted light emitted by the light-emitting elements combining to form mixed light.

2. The system of claim 1 , wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to a first conductive element with a wire bond and (ii) another electrical contact electrically coupled to a second conductive element with at least one of solder or conductive adhesive.

3. The system of claim 1 , wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to an electrical contact of a first different unpackaged LED and (ii) another electrical contact electrically coupled to an electrical contact of a second different unpackaged LED.

4. The system of claim 1 , wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to a first conductive element with a wire bond and (ii) another electrical contact electrically coupled to a second conductive element with a wire bond.

5. The system of claim 1 , wherein at least one unpackaged LED has (i) one electrical contact electrically coupled to a conductive element and (ii) another electrical contact electrically coupled to an electrical contact of a different unpackaged LED.

6. The system of claim 1 , wherein at least one electrical contact of at least one of the unpackaged LEDs is electrically coupled to a conductive element with at least one of solder or conductive adhesive.

7. The system of claim 1 , further comprising at least two connection points, disposed on the carrier, for facilitating electrical connection to the plurality of unpackaged LEDs.

8. The system of claim 1 , wherein at least one electrical contact of at least one of the unpackaged LEDs is electrically coupled to a conductive element with a wire bond.

9. The system of claim 1 , wherein at least some of the unpackaged LEDs are electrically connected in a combination of series and parallel configurations.

10. The system of claim 1 , further comprising at least one optical element configured for at least one of focusing or shaping the mixed light to a desired illumination pattern.

11. The system of claim 1 , wherein the carrier comprises at least one of silicon, aluminum nitride, silicon carbide, diamond, sapphire, aluminum, or copper.

12. The system of claim 1 , further comprising an electrically insulating layer between the thermally conductive carrier and the conductive elements.

13. The system of claim 1 , wherein the carrier is reflective to a wavelength of converted light emitted by the light-conversion material.

14. The system of claim 1 , wherein all of the unpackaged LEDs have substantially the same emission wavelength.

15. The system of claim 1 , wherein at least some of the unpackaged LEDs are electrically connected in parallel.

16. The system of claim 1 , wherein the unpackaged LEDs are attached to the substrate with an adhesive or solder.

17. The system of claim 1 , wherein at least some of the unpackaged LEDs are electrically connected in series.

18. The system of claim 1 , wherein the carrier is reflective to a wavelength of light emitted by the LEDs.

19. The system of claim 1 , wherein the carrier is reflective to a wavelength of the mixed light.

20. The system of claim 1 , wherein the mixed light is substantially white light.

21. The system of claim 1 , wherein the carrier defines a plurality of depressions, and each unpackaged LED is disposed within a depression.

22. The system of claim 21 , wherein each depression is reflective to a wavelength of converted light emitted by the light-conversion material.

23. The system of claim 21 , wherein each depression is reflective to a wavelength of light emitted by the unpackaged LEDs.

24. The system of claim 21 , wherein each depression is reflective to a wavelength of the mixed light.

Assignees

• Tischler Michael A
• Odnoblyudov Vladimir
• Keogh David
• Cooledge Lighting Inc

Inventors

• Tischler Michael A
• Odnoblyudov Vladimir
• Keogh David

Classifications

• F21K9/64

  using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer · CPC title

• F21Y2105/10

  comprising a two-dimensional [2D] array of point-like light-generating elements · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title