Microwave plasma reactor for manufacturing synthetic diamond material
US-2015030786-A1 · Jan 29, 2015 · US
US10910127B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10910127-B2 |
| Application number | US-201916502590-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 3, 2019 |
| Priority date | Nov 6, 2014 |
| Publication date | Feb 2, 2021 |
| Grant date | Feb 2, 2021 |
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In a method of chemical vapor deposition (CVD) growth of a polycrystalline diamond film in a CVD reactor, a gas mixture of gaseous hydrogen and a gaseous hydrocarbon is introduced into the CVD reactor. A plasma formed from the gas mixture is maintained above a surface of a conductive substrate disposed in the CVD reactor and causes a polycrystalline diamond film to grow on the surface of the conductive substrate. A temperature T at the center of the polycrystalline diamond film is controlled during growth of the polycrystalline diamond film. The CVD grown polycrystalline diamond film includes diamond crystallites that can have a percentage of orientation along a [110] diamond lattice direction≥70% of the total number of diamond crystallites forming the polycrystalline diamond film.
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The invention claimed is: 1. A free standing CVD grown polycrystalline diamond film having a thickness ≥100 microns comprising diamond crystallites having a percentage of orientation along a [110] diamond lattice direction ≥70% of the total number of diamond crystallites forming the polycrystalline diamond film, wherein the percentage of orientation along the [110] diamond lattice direction is for the nucleation side. 2. The polycrystalline diamond film of claim 1 , wherein: a percentage of twinning of the diamond crystallites is ≥ 20% of the total number of diamond crystallites forming the polycrystalline diamond film. 3. The polycrystalline diamond film of claim 1 , wherein: the diamond crystallites twin around the [110] diamond lattice direction; and a percentage of twinning of the diamond crystallites is ≥20% of the total number of diamond crystallites forming the polycrystalline diamond film. 4. The polycrystalline diamond film of claim 1 , wherein the polycrystalline diamond film is doped with at least one other element. 5. The polycrystalline diamond film of claim 4 , wherein the at least one other element includes one or more of the following: boron, nitrogen, and oxygen. 6. The polycrystalline diamond film of claim 1 , wherein the polycrystalline diamond film has a diameter≥120 mm. 7. The polycrystalline diamond film of claim 1 , wherein the polycrystalline diamond film has a thickness≥200 microns. 8. The polycrystalline diamond film of claim 1 , wherein the polycrystalline diamond film has a total cracking length≤500 mm. 9. The polycrystalline diamond film of claim 1 , wherein the polycrystalline diamond film is grown at a pressure (P) 100 torr<P≤350 torr in the presence of a gas mixture of gaseous hydrogen (H) and a gaseous hydrocarbon (GH) and a temperature (T) 1000° C.≤T≤1300° C. at the center of the growing diamond film. 10. A free standing CVD grown polycrystalline diamond film having a thickness ≥100 microns comprising diamond crystallites having a percentage of orientation along a [110] diamond lattice direction ≥70% of the total number of diamond crystallites forming the polycrystalline diamond film, wherein a percentage of diamond crystallites that have a [111] orientation at an angle of 35.3° from a plane of the growth surface is ≥40% of the total number of diamond crystallites forming the polycrystalline diamond film. 11. A free standing CVD grown polycrystalline diamond firm having a thickness ≥100 microns comprising diamond crystallites having a percentage of orientation along a [110] diamond lattice direction ≥70% of the total number of diamond crystallites forming the polycrystalline diamond film, wherein a percentage of diamond crystallites that have a [100] orientation at an angle of 45° from a plane of the growth surface is ≥25% of the total number of diamond crystallites forming the polycrystalline diamond film. 12. A free standing CVD grown polycrystalline diamond film having a thickness ≥100 microns comprising diamond crystallites having a percentage of orientation along a [110] diamond lattice direction ≥70% of the total number of diamond crystallites forming the polycrystalline diamond film, wherein a percentage of diamond crystallites that have a combined [100]&[331] orientation at an angle of 45° from a plane of the growth surface is ≥50% of the total number of diamond crystallites forming the polycrystalline diamond film. 13. A free standing CVD grown polycrystalline diamond film having a thickness ≥100 microns comprising diamond crystallites having a percentage of orientation along a [110] diamond lattice direction ≥70% of the total number of diamond crystallites forming the polycrystalline diamond film, wherein the polycrystalline diamond film has a standard deviation in thickness of <9%. 14. A free standing CVD grown polycrystalline diamond film having a thickness ≥100 microns comprising diamond crystallites having a percentage of orientation along a [110] diamond lattice ≥70% of the total number of diamond crystallites forming the polycrystalline diamond film, wherein the polycrystalline diamond film has an average surface roughness (Ra) less than 61 angstroms. 15. A free standing CVD grown polycrystalline diamond film having a thickness ≥100 microns comprising diamond crystallites having a percentage of orientation along a [110] diamond lattice direction ≥70% of the total number of diamond crystallites forming the polycrystalline diamond film, wherein the polycrystalline diamond film has a Peak-to-Valley Ratio (PV) less than 13,500 angstroms.
Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title
using microwave discharges · CPC title
Diamond · CPC title
using hot filaments · CPC title
mainly consisting of carbon-silicon compounds, carbon or silicon · CPC title
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