Semiconductor module including semiconductor package and semiconductor package

Patent metadata

Field	Value
Publication number	US-10908209-B2
Application number	US-201715715625-A
Country	US
Kind code	B2
Filing date	Sep 26, 2017
Priority date	Sep 28, 2016
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

First claim

What is claimed is:

1. A semiconductor module comprising:
a substrate;
a plurality of semiconductor packages provided on the substrate; and
an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages without electrical power,
wherein the environment information indicator comprises:
an X-ray film; and
a first cap attached to a first surface of the X-ray film, the first cap exposing a portion of the first surface of the X-ray film through a first pattern.

2. The semiconductor module of claim 1 , wherein the environment information indicator is configured to display information related to an environment indicating a highest absolute value of the environment that the plurality of semiconductor packages experience.

3. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a second environment information indicator configured to display information related to temperature of the plurality of semiconductor packages.

4. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a plurality of temperature indicators,
wherein each of the plurality of temperature indicators includes a material being discolored in response to a temperature of the environment surrounding the plurality of semiconductor packages reaching a critical value, and
wherein the critical values of the plurality of temperature indicators are different from one another.

5. The semiconductor module of claim 4 , wherein the plurality of temperature indicators are irreversibly discolored.

6. The semiconductor module of claim 4 , wherein the plurality of temperature indicators include thermochromic inks or thermosensitive inks.

7. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a second environment information indicator configured to display information related to humidity.

8. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a plurality of humidity indicators,
wherein each of the plurality of humidity indicators includes a material being discolored in response to humidity of the environment surrounding the plurality of semiconductor packages reaching a critical value, and
wherein the critical values of the plurality of humidity indicators are different from one another.

9. The semiconductor module of claim 8 , wherein the plurality of humidity indicators include cobalt chloride or anhydrous copper sulfate.

10. The semiconductor module of claim 1 , wherein the environment information indicator is further configured to display an X-ray being irradiated to the plurality of semiconductor packages.

11. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a second cap attached to a second surface opposite to the first surface of the X-ray film, the second cap exposing a portion of the second surface of the X-ray film through a second pattern.

12. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a plurality of X-ray indicators,
wherein each of the plurality of X-ray indicators comprises: an X-ray film; and a cap exposing a portion of the X-ray film through a pattern provided on the cap, and
wherein X-ray transmittances of the caps of the plurality of X-ray indicators are different from one another.

13. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a second environment information indicator configured to display electrical overstress (EOS) applied to the plurality of semiconductor packages.

14. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a plurality of fuses, and
wherein current amounts blowing the plurality of fuses are different from one another.

15. The semiconductor module of claim 14 , wherein the plurality of fuses are coated with thermochromic inks or thermosensitive inks, and
wherein the thermochromic inks or the thermosensitive inks have critical values at which the thermochromic inks or the thermosensitive inks are discolored by heat occurring in response to the plurality of fuses being blown.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Won Seyoung
• Kang Dan-Kyu
• Lee Sang-Yeol

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W42/80

  protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title