Filler particle position and density manipulation with applications in thermal interface materials

Patent metadata

Field	Value
Publication number	US-10903184-B2
Application number	US-201816109182-A
Country	US
Kind code	B2
Filing date	Aug 22, 2018
Priority date	Aug 22, 2018
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

A thermal interface material and systems and methods for forming a thermal interface material include depositing a layer of a composite material, including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material. A particle manipulator is positioned over the layer of the composite material, the particle manipulator including at least one emitter to apply a particle manipulating field to bias a movement of the filler particles. The second material is redistributed by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot.

First claim

What is claimed is:

1. A method for forming a thermal interface material, the method comprising: depositing a layer of a composite material, including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material; positioning a particle manipulator directly over only one side of the layer of the composite material, the particle manipulator including two electro-magnetic heads each having a trapezoidal shape with a shorter side facing a shorter side of the other in a cross-sectional view and each generating a magnetic field, the magnetic fields oriented in a direction opposite to each other and between the magnetic heads, to apply a particle manipulating field to bias a movement of the filler particle, the particle manipulator being a movable device translating across a plane parallel to the composite material; and redistributing the second material by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot of a semiconductor device.

2. The method as recited in claim 1 , wherein the two electro-magnetic heads are controlled by a processor and a power supply to vary in strength and direction according to a controllably applied voltage and current.

3. The method as recited in claim 1 , further including annealing the first material to harden the first material.

4. The method as recited in claim 3 , wherein annealing the first material includes heating the first material with a heating device selected from the group consisting of a laser, a furnace and an induction heater.

5. The method as recited in claim 1 , wherein repositioning the second material includes forming the high concentration region with a concentration gradient that decreases towards the surrounding region.

6. The method as recited in claim 1 , wherein the particle manipulator includes particle manipulation selected from the group consisting of ultra-sonic vibration, electro-static manipulation and thermal convention.

7. The method as recited in claim 1 , wherein the magnetic field pulls the second material through the first material into a middle region between the two electro-magnetic heads of the particle manipulator.

8. The method as recited in claim 1 , wherein the layer of composite material is deposited on a semiconductor device.

9. The method as recited in claim 8 , wherein the high concentration region is positioned within the composite material over a hotspot formed by an active component of the semiconductor device.

10. The method as recited in claim 1 , further including attaching a heat sink to a semiconductor device via the layer of composite material by hardening the layer of composite material such that the surrounding region mechanically attaches the heat sink to the semiconductor device.

11. A method for forming a thermal interface material, the method comprising: depositing a layer of a composite material on a semiconductor device including an active component, the composite material including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material; positioning a particle manipulator directly over only one side of the layer of the composite material, the particle manipulator including two electro-magnetic heads each having a trapezoidal shape with a shorter side facing a shorter side of the other in a cross-sectional view and each generating a magnetic field, the magnetic fields oriented in a direction opposite to each other and between the magnetic heads, to apply a particle manipulating field to bias a movement of the filler particle, the particle manipulator being a movable device translating across a plane parallel to the composite material; redistributing the second material by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot of the semiconductor device; and attaching a heat sink to the semiconductor device via the layer of the composite material.

12. The method as recited in claim 11 , wherein the two electro-magnetic heads are controlled by a processor and a power supply to vary in strength and direction according to a controllably applied voltage and current.

13. The method as recited in claim 11 , further including annealing the first material to harden the first material.

14. The method as recited in claim 13 , wherein annealing the first material includes heating the first material with a heating device selected from the group consisting of a laser, a furnace and an induction heater.

15. The method as recited in claim 11 , wherein repositioning the second material includes forming the high concentration region with a concentration gradient that decreases towards the surrounding region.

16. The method as recited in claim 11 , wherein the particle manipulator includes particle manipulation selected from the group consisting of ultra-sonic vibration, electro-static manipulation and thermal convention.

17. The method as recited in claim 11 , wherein the magnetic field pulls the second material through the first material into a middle region between two the electro-magnetic heads of the particle manipulator.

18. A thermal interface material comprising: a layer of a first material including a cured carrier fluid; a second material embedded within the first material such that the second material is concentrated in a high concentration region of the first material, via a particle manipulator positioned directly over only one side of the layer of the first material, the particle manipulator including two electro-magnetic heads each having a trapezoidal shape with a shorter side facing a shorter side of the other in a cross-sectional view and each generating a magnetic field, the magnetic fields oriented in a direction opposite to each other and between the magnetic heads, to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot of a semiconductor device, the high concentration region being surrounded by a low concentration region having a lower density of the second material than the high concentration region, wherein the particle manipulator is a movable device translating across a plane parallel to the first material.

19. The thermal interface material as recited in claim 18 , wherein the two electro-magnetic heads are controlled by a processor and a power supply to vary in strength and direction according to a controllably applied voltage and current.

20. The thermal interface material as recited in claim 18 , wherein the high concentration region is positioned within the composite material over a hotspot formed by an active component of a semiconductor device.

Assignees

• IBM

Inventors

• Fry Jonathan
• Sinha Tuhin
• Rizzolo Michael
• Hamieh Bassem M

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/01365

  Thermally treating (reflowing H10W72/01357) · CPC title

• H10W72/01361

  Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01351) · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title