Coil electronic component

Patent metadata

Field	Value
Publication number	US-10902994-B2
Application number	US-201815988497-A
Country	US
Kind code	B2
Filing date	May 24, 2018
Priority date	Oct 17, 2017
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.

First claim

What is claimed is:

1. A coil electronic component comprising:
a body including a plurality of insulating layers and coil patterns disposed on the insulating layers; and
external electrodes formed on external surfaces of the body and connected to the coil patterns,
wherein each of the external electrodes include a first electroless plating layer and a second layer disposed on the first electroless plating layer, the second layer comprising metal particles dispersed in a polymer base,
wherein a thickness of each of the first electroless plating layers is in a range from 5 μm to 15 μm with a thickness deviation of less than 0.5 μm.

2. The coil electronic component of claim 1 , wherein each of the first electroless plating layer is a copper (Cu) electroless plating layer.

3. The coil electronic component of claim 1 , wherein the metal particles of each of the second layer are silver (Ag) particles.

4. The coil electronic component of claim 1 , wherein each first electroless plating layer is in direct contact with a corresponding second layer.

5. The coil electronic component of claim 4 , wherein each of the first electroless plating layers is a Cu electroless plating layer, and the metal particles of each of the second layers are Ag particles.

6. The coil electronic component of claim 5 , wherein some Cu components of the Cu electroless plating layer are substituted with Ag components of the Ag particles.

7. The coil electronic component of claim 1 , wherein a content of the metal particles in each of the second layers is 15 wt % or less.

8. A coil electronic component comprising:
a body including a plurality of insulating layers and coil patterns disposed on the insulating layers; and
external electrodes formed on external surfaces of the body and connected to the coil patterns,
wherein each of the external electrodes include a first electroless plating layer and a second layer disposed on the first electroless plating layer, the second layer comprising metal particles dispersed in a polymer base,
wherein a thickness of each of the first electroless plating layers is in a range from 5 μm to 15 μm, and
wherein an average diameter of the metal particles in the second layer is 50 nm or less.

9. The coil electronic component of claim 1 , wherein a thickness of each of the second layers is in a range from 0.01 μm to 1.0 μm, and a thickness deviation of less than 0.2 μm.

10. The coil electronic component of claim 1 , wherein each of the second layers is an outermost layer of a corresponding external electrode.

11. The coil electronic component of claim 1 , wherein each of the external electrodes has an L shape or a linear shape.

12. The coil electronic component of claim 1 , wherein each of the external electrodes is only formed on one surface of the body.

13. The coil electronic component of claim 1 , wherein the body further includes lead portions connecting ends of the coil patterns and corresponding external electrodes to each other.

14. The coil electronic component of claim 13 , wherein each of the first electroless plating layers is in direct contact with the lead portion.

15. A coil electronic component comprising:
a body comprising insulating layers, each having a coil pattern disposed thereon; and
external electrodes disposed on external surfaces of the body and connecting to corresponding ends of the coil patterns, each of the external electrodes comprising a first plating layer and a second layer comprising a polymer and metal particles,
wherein the first plating layer has a thickness deviation of less than 0.5 μm,
wherein an average diameter of the metal particles in the second layer is 50 nm or less, and
wherein a thickness of the second layer is in a range from 0.01 μm to 1.0 μm.

16. The coil electronic component of claim 15 , wherein a deviation in thickness of the first plating layer is 5% or less of an average thickness of the first plating layer.

17. The coil electronic component of claim 15 , wherein adjacent coil patterns are electrically connected using conducting vias penetrating through a corresponding insulating layer, the vias comprising bump structures.

18. The coil electronic component of claim 15 , wherein a content of the metal particles in the second layer is 15 wt % or less.

19. The coil electronic component of claim 15 , wherein the polymer of the second layer is selected to have a melting point such that the polymer melts during a soldering process performed when mounting the coil electronic component on a board.

Assignees

• Samsung Electro Mech

Inventors

• Kim Chi Seong
• Kang Jun Il
• Lee Sa Yong
• Hyung Gun Hwi

Classifications

• H01F27/28 Primary

  Coils; Windings; Conductive connections · CPC title

• H01F1/015

  Metals or alloys · CPC title

• H01F27/292 Primary

  Surface mounted devices · CPC title

• H01F17/0013

  with stacked layers · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title