Mold test apparatus and method

Patent metadata

Field	Value
Publication number	US-10900883-B2
Application number	US-201816049099-A
Country	US
Kind code	B2
Filing date	Jul 30, 2018
Priority date	Feb 21, 2018
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.

First claim

What is claimed is:

1. A mold test apparatus comprising:
a mold support plate comprising a top surface on which a mold is mounted, wherein the mold support plate comprises a plurality of test suction pipes communicating with paths in the mold and protruding upward from the mold support plate;
vacuum pipes each having one end connected to one of the plurality of test suction pipes;
a pump connected to the other end of the vacuum pipes; and
at least one pressure sensor configured to measure a pressure of at least one vacuum pipe from among the vacuum pipes,
wherein the paths communicate with adsorption holes formed in a top surface of the mold, wherein the at least one pressure sensor comprises a determining unit configured to determine whether an adsorption hole from among the adsorption holes is clogged by using the pressure measured, and wherein the test suction pipes communicate with the paths via suction ports formed in a bottom surface of the mold.

2. The mold test apparatus of claim 1 , wherein the determining unit determines how many of the adsorption holes are clogged such that the determining unit determines that at least two of the adsorption holes are clogged.

3. The mold test apparatus of claim 1 , wherein the test suction pipes communicate with the paths via suction ports formed in a bottom surface of the mold.

4. The mold test apparatus of claim 1 , wherein the pump comprises a vacuum pump configured to generate a negative pressure.

5. The mold test apparatus of claim 1 , wherein the mold support plate further comprises a positioning pin configured to adjust a position of the mold.

6. The mold test apparatus of claim 1 , wherein the mold support plate further comprises a fixing pin configured to fix the mold.

7. The mold test apparatus of claim 1 , wherein a size of each of the adsorption holes is in a range of 0.1 to 1 mm.

8. The mold test apparatus of claim 1 , wherein portions of the vacuum pipes are connected to each other so that the pump communicates with at least one test suction pipe.

9. The mold test apparatus of claim 8 , wherein a valve is installed at the vacuum pipes.

10. The mold test apparatus of claim 1 , wherein the mold comprises an upper mold or a lower mold for molding a semiconductor package.

11. A method of testing a mold, comprising:
mounting a mold on a top surface of a mold support plate so that a plurality of test suction pipes disposed on the mold support plate are in close contact with suction ports on a lower surface of the mold, the suction ports communicating with paths in the mold;
fixing the mounted mold; and
measuring, by a pressure sensor, pressures of vacuum pipes; configured to connect the plurality of test suction pipes to a pump,
wherein the paths in the mold communicate with film adsorption holes formed in a top surface of the mold.

12. The method of claim 11 , further including determining whether the film adsorption holes are clogged by using pressures of vacuum pipes measured by the pressure sensor.

13. The method of claim 12 , wherein the determining comprises determining how many of the film adsorption holes are clogged by comparing pressures measured with a previously input pressure value, wherein at least two of the film adsorption holes are determined to be clogged.

14. The method of claim 11 , wherein pressure measuring is performed on each of the vacuum pipes.

15. The method of claim 11 , wherein the mold comprises an upper mold or a lower mold for molding a semiconductor package.

16. A mold test apparatus comprising:
a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate comprises a plurality of test suction pipes communicating with paths in the mold and protruding upward from the mold support plate;
vacuum pipes each having one end connected to one of the plurality of test suction pipes;
a pump connected to the other end of the vacuum pipes; and
at least one pressure sensor configured to measure a pressure of the vacuum pipes,
wherein the mold comprises a plurality of regions having adsorption holes,
wherein the paths communicate with adsorption holes disposed in one region of the plurality of regions,
wherein the adsorption holes comprise film adsorption holes, and
wherein the test suction pipes communicate with the paths via suction ports formed in a bottom surface of the mold.

17. The mold test apparatus of claim 16 , further including a determining unit configured to determine, while the mold is in a non-molding state, whether the adsorption holes are clogged by using the pressure measured by the pressure sensor.

18. The mold test apparatus of claim 17 , wherein the determining unit determines how many of the adsorption holes are clogged such that the determining unit determines that at least two of the adsorption holes are clogged.

19. The mold test apparatus of claim 17 , wherein the adsorption holes include substrate adsorption holes.

20. The mold test apparatus of claim 17 , wherein the pump comprises a vacuum pump configured to generate a negative pressure.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jung Jung Lae
• Kim Tea Geon

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/016

  using moulds · CPC title

• B29C2043/585

  detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage · CPC title

• B29C2033/705

  Mould inspection means, e.g. cameras · CPC title

• B29C43/58 Primary

  Measuring, controlling or regulating {(for bank adjustment in calendering B29C43/245)} · CPC title