Device for molding semiconductor package

Patent metadata

Field	Value
Publication number	US-10131077-B2
Application number	US-201615332233-A
Country	US
Kind code	B2
Filing date	Oct 24, 2016
Priority date	Feb 3, 2016
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

First claim

What is claimed is:

1. A device for molding a semiconductor package, the device comprising:
an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon;
a lower mold defining a cavity, the lower mold including an outer circumferential portion defining a sidewall of the cavity and a plurality of moving blocks defining a bottom surface of the cavity, the cavity configured to contain a molding resin;
a driving unit configured to independently move each of the moving blocks; and
a controller configured to control an moving order of the moving blocks by controlling the driving unit.

2. The device for molding claim 1 , wherein the lower mold further includes an outer circumferential structure defining a sidewall of the cavity.

3. The device for molding claim 1 , wherein the moving blocks are arranged in a first direction that crosses moving direction of the moving blocks.

4. The device for molding claim 3 , wherein the controller is configured to raise the moving blocks in an arrangement order thereof in the first direction.

5. The device for molding claim 3 , wherein the controller is configured to raise one of the moving blocks in a center portion of the moving blocks first, and raise other ones of the moving blocks in an order of proximity to the one of the moving blocks in the center portion.

6. The device for molding claim 1 , wherein the moving blocks include a central moving block in a center portion of the moving blocks, and one or more moving blocks surrounding the central moving block.

7. The device for molding claim 6 , wherein the controller is configured to raise the central moving block first, and raise the one or more moving blocks in an order of proximity to the central moving block in a direction from the center portion of the moving blocks to edges of the moving blocks.

8. The device for molding claim 6 , wherein the controller is configured to raise an outermost moving block from among the moving blocks first, and raise other moving blocks from among the moving blocks in an order of proximity to the outermost moving block in a direction from edges of the moving blocks to a center portion thereof.

9. The device for molding claim 1 , wherein
the lower mold further includes a supporting block configured to support the moving blocks at a side opposite to the cavity with respect to the moving blocks, and
the driving unit is further configured to move the supporting block in a vertical direction.

10. The device for molding claim 1 , wherein the controller comprises,
a pressure controller configured to adjust a pressure applied to the molding resin by each of the moving blocks, and
a temperature controller configured to control a temperature of each of the moving blocks.

11. A device for molding a semiconductor package, the device comprising:
an upper mold configured to retain a substrate, the substrate having semiconductor chips thereon;
a lower mold defining a cavity, the lower mold including an outer circumferential portion defining a sidewall of the cavity and a plurality of moving blocks defining a bottom surface of the cavity, the cavity configured to contain a molding resin, each of the moving blocks configured to move between a first level and a second level higher than the first level;
a driving unit configured to independently move each of the moving blocks between the first level and the second level; and
a controller configured to control a first order by which respective ones of the moving blocks ascend, temperatures of the moving blocks, and pressures applied to the molding resin by respective ones of the moving blocks.

12. The device for molding claim 11 , wherein the controller, after all of the moving blocks ascend to the second level, is configured to raise temperatures of the moving blocks to a curing temperature of the molding resin or higher.

13. The device for molding claim 11 , wherein the controller is configured to raise the respective ones of the moving blocks by the first order, and raise temperatures of the moving blocks to a curing temperature of the molding resin or higher according to a second order by which the respective ones of the moving blocks reach the second level.

14. The device for molding claim 11 , wherein the moving blocks are arranged in a first direction that crosses moving directions of the moving blocks.

15. The device for molding claim 11 , wherein the moving blocks are arranged in array including at least two rows and at least two columns.

16. A device for molding a semiconductor package, the device comprising:
an upper mold configured to retain a substrate thereon, the substrate including at least one semiconductor chip thereon;
a lower mold including a plurality of moving blocks and at least one outer circumferential structure, the moving blocks and the at least one outer circumferential structure defining a cavity, each of the moving blocks configured to independently ascend and descend, the moving blocks defining a bottom surface of the cavity, and the outer circumferential structure defining a sidewall of the cavity; and
a controller configured to control an order by which respective ones of the moving blocks ascend and descend.

17. The device for molding claim 16 , wherein the moving blocks include a central moving block and one or more other moving blocks, the one or more other moving blocks at least one of surrounding the central moving block or being at both sides of the central moving block.

18. The device for molding claim 17 , wherein the controller is configured to,
at least one of
(1) raise the central moving block, and subsequently raise the one or more other moving blocks in an order of proximity to the central moving block, or
(2) raise an outermost moving block from among the moving blocks, and subsequently raise other moving blocks from among the moving blocks in an order of proximity to the outermost moving block.

19. The device for molding claim 16 , wherein the controller is further configured to,
adjust a pressure applied to a molding resin by each of the moving blocks, and
control a temperature of each of the moving blocks.

20. The device for molding claim 16 , further comprising:
a supporting block configured to ascend and descend to support the moving blocks at a side opposite to the cavity with respect to the moving blocks.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Bae Kwang-Jin

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/016

  using moulds · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title