Nanowire and micro wire fabrication technique and product

US10900137B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10900137-B2
Application numberUS-201815872913-A
CountryUS
Kind codeB2
Filing dateJan 16, 2018
Priority dateJul 24, 2012
Publication dateJan 26, 2021
Grant dateJan 26, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used to remove the wires from the template and in one embodiment to draw a continuous wire from the template to be wound around the drum.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of fabricating wire comprising the steps of: moving a template through a chamber of electrochemical solution, the template having a disk shape with a face having a surface structure with a conductive layer with an electrically conductive ultranano crystalline diamond edge formed in a predefined pattern, the template mounted for rotation about a first axis perpendicular to the face; immersing at least a portion of the electrically conductive ultranano crystalline diamond edge of the template in the electrochemical solution; applying an electrical power source between the electrochemical solution in the chamber and the electrically conductive ultranano crystalline diamond edge of the template; forming a wire on the electrically conductive ultranano crystalline diamond edge interacting with the electrochemical solution; and removing the formed wire with a transfer element; interacting a chamfered edge of the transfer element with the surface, parallel to the surface, the chamfered edge having an adhesive surface and mounted for movement with respect to the template and contact with the template; and removing from the template at least a portion of the wire grown by electrochemical action on the structure of the template. 2. The method of claim 1 , wherein the template is substantially planar. 3. The method of claim 1 , further comprising rotating the transfer element about a second axis angled with respect to the first axis, wherein the chamfered edge contacts the surface of the template and follows an annular track on the surface of the template concentric about the first axis on the template with mutual rotation of the transfer element and template. 4. The method of claim 3 , further comprising rotating a drum about a third axis and contacting a drum adhesive surface and the chamfered edge to pull wires off of the transfer element with rotating contact between the drum and transfer element. 5. The method of claim 4 , further comprising spooling a wire received from the transfer element into a helical coil along a surface of the drum. 6. The method of claim 5 , further comprising immersing at least a portion of the transfer element chamfered edge in a second chamber having a releasing liquid. 7. A method of fabricating wire comprising the steps of: moving a template through a chamber of electrochemical solution, the template having a surface and a conductive layer with an electrically conductive ultranano crystalline diamond edge formed in a predefined pattern, the template mounted for rotation about a first axis perpendicular to the surface; immersing at least a portion of the electrically conductive ultranano crystalline diamond edge of the template in the electrochemical solution; applying an electrical power source between the electrochemical solution in the chamber and the electrically conductive ultranano crystalline diamond edge of the template; forming a wire on the electrically conductive ultranano crystalline diamond edge by: interacting a chamfered edge of the transfer element with the surface, parallel to the surface, the chamfered edge having an adhesive surface and mounted for movement with respect to the template and contact with the template; and removing from the template at least a portion of the wire grown by electrochemical action on the template; and removing the formed wire with a transfer element. 8. The method of claim 7 , wherein the template is substantially planar. 9. The method of claim 7 , further comprising rotating the transfer element about a second axis angled with respect to the first axis, wherein the chamfered edge contacts the surface of the template and follows an annular track on the surface of the template concentric about the first axis on the template with mutual rotation of the transfer element and template. 10. The method of claim 7 , further comprising rotating a drum about a third axis and contacting a drum adhesive surface and the chamfered edge to pull wires off of the transfer element with rotating contact between the drum and transfer element. 11. The method of claim 7 , further comprising spooling a wire received from the transfer element into a helical coil along a surface of the drum. 12. The method of claim 7 , further comprising immersing at least a portion of the transfer element chamfered edge in a second chamber having a releasing liquid.

Assignees

Inventors

Classifications

  • C25D1/04Primary

    Wires; Strips; Foils · CPC title

  • Nanostructures, e.g. using aluminium anodic oxidation templates [AAO] · CPC title

  • Electroforming · CPC title

  • C25D1/10Primary

    Moulds; Masks; Masterforms · CPC title

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Frequently asked questions

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What does patent US10900137B2 cover?
A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used …
Who is the assignee on this patent?
Uchicago Argonne Llc
What technology area does this patent fall under?
Primary CPC classification C25D1/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 26 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).