Heated floor panel with impact layer

US10899427B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10899427-B2
Application numberUS-201816026899-A
CountryUS
Kind codeB2
Filing dateJul 3, 2018
Priority dateJul 3, 2018
Publication dateJan 26, 2021
Grant dateJan 26, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heated floor panel assembly with an impact layer is made to absorb blunt force and protect a heating element inside the assembly. The assembly further includes a plurality of structural layer made of a reinforced polymer matrix, one or more core layer with a honeycomb or foam structure for absorbing shear stress, and a heating layer containing the heating element. The impact layer is a composite layer with a resin impregnated fiber matrix.

First claim

Opening claim text (preview).

The invention claimed is: 1. A floor panel assembly having a bottom surface and a top surface, the floor panel assembly comprising: a first stack of structural layers adjacent the bottom surface; a first core layer, adjacent the first stack of structural layers, that absorbs shear stress; a second core layer between the first core layer and the top surface, that absorbs shear stress; a heating layer sandwiched between the first and second core layers; a second stack of structural layers between the second core layer and the top surface; and a first impact layer between the second stack of structural layers and the top surface, the impact layer comprising: a fiber matrix; and a thermoplastic resin infiltrating the fiber matrix; wherein the first stack of structural layers, the core layer, the second stack of structural layers, the heating layer, and the impact layer are bonded together. 2. The floor panel assembly of claim 1 , wherein the first and second stacks of structural layers comprise a reinforced polymer matrix comprising a structural fiber matrix impregnated with a structural resin. 3. The floor panel of claim 2 , wherein the structural fiber matrix is a carbon fiber or fiberglass. 4. The floor panel of claim 2 , wherein the structural resin is polyether ether ketone, polycarbonate, polyphenylene sulfide, polyetherimide, epoxy, phenolic, bismaleimide, benzoxazine, or combinations thereof. 5. The floor panel assembly of claim 1 , wherein the first core layer comprises a high density metallic material in a honeycomb structure selected from the group consisting of aluminum alloys, stainless steel, and titanium. 6. The floor panel assembly of claim 1 , wherein the first core layer comprises an expanded honeycomb polymer, an open-cell polymer foam, or closed-cell polymer foam. 7. The floor panel assembly of claim 1 , wherein the heating layer comprises a metallic material, Positive Temperature Control (PTC) ceramic, PTC polymer, or carbon allotrope material. 8. The floor panel assembly of claim 1 , wherein the fiber matrix of the impact layer comprises fiberglass, carbon fiber, thermoplastic fiber, or metallic fiber. 9. The floor panel assembly of claim 1 , wherein the thermoplastic resin is selected from the group consisting of polyetheretherketone, polyaryletherketones, polycarbonate, polyphenylene sulfide, polyetherimide, polyimide, polymethylmethacrylate (acrylic), polyvinylchloride, polyurethane, and polyamideimide, epoxy, phenolic, BMI, benzoxazine, and polyurethane. 10. The floor panel assembly of claim 1 , wherein the thermoplastic resin has an elongation to break of 30% to 150%. 11. The floor panel assembly of claim 1 , wherein the thermoplastic resin has a breaking strength of 30 MPa to 120 MPa. 12. The floor panel assembly of claim 1 , wherein the thermoplastic resin has a density of 0.9 g/cm 3 to 1.7 g/cm 3 . 13. The floor panel assembly of claim 1 , wherein the impact layer further comprises reinforcements selected from the group consisting of aramid fibers, fiberglass, basalt, carbon fiber, carbon nanotube, nano steel, steel wire, titanium wire, and combinations thereof. 14. The floor panel assembly of claim 1 , wherein the impact layer does not exhibit degradation due to temperature between temperature of −55° C. and 85° C. 15. The floor panel assembly of claim 1 , wherein the second core layer comprises a high density metallic material in a honeycomb structure, an expanded honeycomb polymer, an open-cell polymer foam, or closed-cell polymer foam. 16. The floor panel assembly of claim 15 , wherein the first core layer comprises a material different than the second core layer. 17. The floor panel assembly of claim 1 , further comprising a second impact layer between the second stack of structural layers and the core layer, wherein the first stack of structural layers is adjacent the bottom surface, the first core layer is between the first stack of structural layer and the top surface and adjacent the first stack of structural layers, the heating layer is between the first core layer and the top surface and adjacent the first core layer, the second core layer is between the heating layer and the top surface and adjacent the heating layer, the second impact layer is between the second core layer and the top surface and adjacent the second core layer, the second stack of structural layers is between the second impact layer and the top surface and adjacent the second impact layer, and the first impact layer is between the second stack of structural layers and the top surface. 18. A floor panel assembly having a top and bottom surface and comprising: a first stack of structural layers adjacent the bottom surface; a core assembly comprising a first core layer that absorbs stress, a second core layer that absorb shear stress, and a heating layer disposed between and contacting each of the first core layer and the second core layer, wherein the core assembly is adjacent the first stack of structural layers; a first impact layer between the core assembly and the top surface; a second stack of structural layers between the first impact layer and the top surface; and a second impact layer between the second stack of structural layers and the top surface, the impact layer comprising: a fiber matrix; and a thermoplastic resin infiltrating the fiber matrix; wherein the first stack of structural layers, the core assembly, the first impact layer, the second stack of structural layers, and the second impact layer are bonded together. 19. The floor panel assembly of claim 18 , wherein the first and second core layers are formed from a material selected from a group consisting of a high density metallic material in a honeycomb structure, an expanded honeycomb polymer, an open-cell polymer foam, and a closed-cell polymer foam. 20. The floor panel assembly of claim 18 , wherein the thermoplastic resin is selected from a group consisting of polyetheretherketone, polyaryletherketones, polycarbonate, polyphenylene sulfide, polyetherimide, polyimide, polymethylmethacrylate (acrylic), polyvinylchloride, polyurethane, and polyamideimide, epoxy, phenolic, BMI, benzoxazine, and polyurethane.

Assignees

Inventors

Classifications

  • Fuselages; Constructional features common to fuselages, wings, stabilising surfaces or the like · CPC title

  • Impact strength, toughness · CPC title

  • Aircraft · CPC title

  • Fibrous or filamentary layer · CPC title

  • Synthetic macromolecular fibres · CPC title

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Frequently asked questions

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What does patent US10899427B2 cover?
A heated floor panel assembly with an impact layer is made to absorb blunt force and protect a heating element inside the assembly. The assembly further includes a plurality of structural layer made of a reinforced polymer matrix, one or more core layer with a honeycomb or foam structure for absorbing shear stress, and a heating layer containing the heating element. The impact layer is a compos…
Who is the assignee on this patent?
Goodrich Corp
What technology area does this patent fall under?
Primary CPC classification B64C1/18. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 26 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).