Method of using laminated dressing board
US-10668595-B2 · Jun 2, 2020 · US
Dressing method of cutting blade
US10898983B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10898983-B2 |
| Application number | US-201816233783-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 27, 2018 |
| Priority date | Dec 28, 2017 |
| Publication date | Jan 26, 2021 |
| Grant date | Jan 26, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A dressing method of a cutting blade includes a first cutting step of causing the cutting blade to cut into a dressing board held by a holding surface of a chuck table with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to form a cut groove in the dressing board, and a second cutting step of causing the cutting blade to further cut into the groove bottom of the cut groove formed in the first cutting step with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to carry out cutting on the groove bottom with tracing of the cut groove.
First claim
Opening claim text (preview).
What is claimed is: 1. A dressing method of a cutting blade in which a plate-shaped dressing board is cut by the cutting blade mounted to a spindle and the cutting blade is shaped to reduce a region of roundness at a tip of the cutting blade, the dressing method comprising: a first cutting step of causing the cutting blade to cut into the dressing board held by a holding surface of a chuck table with a cutting depth that does not surpass a length of the region of roundness in a radial direction of the cutting blade, and relatively moving the chuck table and the cutting blade in a direction that is parallel to the holding surface and is perpendicular to an axial center of the spindle to form a cut groove in the dressing board; and a second cutting step of causing the cutting blade to further cut into a groove bottom of the cut groove formed in the first cutting step with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade, and relatively moving the chuck table and the cutting blade in the direction that is parallel to the holding surface and is perpendicular to the axial center of the spindle to carry out cutting on the groove bottom with tracing of the cut groove. 2. The dressing method of a cutting blade according to claim 1 , the dressing method further comprising: a determination step of measuring a shape of the region of roundness in the cutting blade after the second cutting step is carried out and determining to end shaping of the cutting blade if the shape of the region of roundness satisfies a predetermined condition, and determining to carry out the first cutting step or the second cutting step if the shape of the region of roundness does not satisfy the predetermined condition.
Assignees
Inventors
Classifications
Cutting or separating of wafers, substrates or parts of devices · CPC title
- H10P72/0428Primary
Apparatus for mechanical treatment or grinding or cutting · CPC title
- B24B3/36Primary
of cutting blades (B24B3/58 takes precedence) · CPC title
Dressing tools; Holders therefor · CPC title
of disc blades · CPC title
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- What does patent US10898983B2 cover?
- A dressing method of a cutting blade includes a first cutting step of causing the cutting blade to cut into a dressing board held by a holding surface of a chuck table with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to form a cut groove in the dressing board, and a second cutting step of causing the cutting blade to f…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 26 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).