Ion beam mill etch depth monitoring with nanometer-scale resolution

Patent metadata

Field	Value
Publication number	US-10896803-B2
Application number	US-201715681210-A
Country	US
Kind code	B2
Filing date	Aug 18, 2017
Priority date	Aug 19, 2016
Publication date	Jan 19, 2021
Grant date	Jan 19, 2021

Abstract

A method for measuring conductance of a material real-time during etching/milling includes providing a fixture having a socket for receiving the material. The socket is attached to a printed circuit board (PCB) mounted on one side of a plate that has at least one opening for providing ion beam access to the material sample. Conductive probes extend from the other side of the PCB to contact and span a target area of the material. A measurement circuit in electrical communication with the probes measures the voltage produced when a current is applied across the material sample to measure changes in electrical properties of the sample over time.

First claim

The invention claimed is:

1. A fixture for measuring conductance of a material real-time during etching/milling of the material, comprising: a thermally-conductive base; a socket attached to the base, the socket having at least one recess formed therein for receiving a material sample; a printed circuit board (PCB) having a first side, a second side, and at least one PCB opening therethrough; a plate attached to the first side of the PCB, the plate having at least one plate opening therethrough aligned with the at least one PCB opening for providing etch/milling beam access to the material sample, the plate and PCB configured to be releasably attached to the socket; a plurality of conductive probes extending from the second side of the PCB, the probes configured to removably contact and span a target area of the material to be etched, and wherein the PCB has circuitry formed thereon in electrical communication with the probes, and wherein the at least one PCB opening and the at least one plate opening are each configured to expose a target area of the material to the etch/milling beam while masking the probes from the etch/milling beam and from re-deposition of removed material; and a measurement circuit in electrical communication with the probes, wherein a current applied across a first pair of the probes produces a voltage across the material sample to a second pair of the probes to measure changes in electrical properties of the sample over time.

2. The fixture of claim 1 , wherein the plurality of conductive probes are spring pins.

3. The fixture of claim 1 , wherein the measurement circuit comprises:
a lock-in amplifier comprising a sinusoidal current source;
a load resistor;
first conductors connected to the first pair of probes;
second conductors connected to the second pair of probes; and
a preamplifier for receiving an input from the second conductors, the preamplifier having a gain;
wherein an output of the preamplifier is input into the lock-in amplifier for data acquisition.

4. The fixture of claim 3 , wherein the measurement circuit further comprises a filter disposed between each of the second pair of probes and the preamplifier.

5. The fixture of claim 1 , wherein the thermally-conductive base comprises copper.

6. The fixture of claim 1 , wherein the plate is formed from ceramic.

7. The fixture of claim 1 , wherein the socket is formed from aluminum.

8. The method for monitoring changes in conductance of a material with time during etching/milling of the material, comprising:
retaining the material within the fixture of claim 1 ; and
connecting the fixture to a detection device for measuring conductance.

9. The method of claim 8 , wherein the measurement circuit comprises:
a lock-in amplifier comprising a sinusoidal current source;
a load resistor;
first conductors connected to the first pair of probes;
second conductors connected to the second pair of probes; and
a preamplifier for receiving an input from the second conductors, the preamplifier having a gain;
wherein an output of the preamplifier is input into the lock-in amplifier for data acquisition.

10. The method of claim 9 , wherein the plurality of conductive probes are spring pins.

11. The method of claim 9 , wherein the measurement circuit further comprises a filter disposed between each of the second pair of probes and the preamplifier.

12. The method of claim 8 , wherein the thermally-conductive base comprises copper.

13. The method of claim 8 , wherein the socket is formed from aluminum.

14. A method for monitoring removal of a material during etch/milling comprising:
enclosing a material sample within a fixture so that the material sample is contacted by a four point probe having two current probes electrically connected to a sinusoidal current source and two voltage probes electrically connected to a voltage detection circuit, the fixture comprising a masking structure having at least one opening formed therein, the at least one opening configured to expose a target area of the material sample to an etch/milling beam while masking the probes from the etch/milling beam and from re-deposition of removed material;
measuring changes in conductance of the material sample with time as the etch/milling beam is directed onto the target area through the at least one opening.

15. The method of claim 14 , wherein the four point probes are spring pins.

16. The method of claim 14 , wherein the fixture includes a thermally-conductive base, and further comprising placing the base in contact with a heat exchanging system.

Assignees

• Univ California

Inventors

• Cybart Shane A
• Dynes Robert C

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• G01B7/06 Primary

  for measuring thickness {(measuring during the manufacture of coatings C23C14/54)} · CPC title

• G01B7/26

  for measuring depth · CPC title

• H01J37/304

  Controlling tubes by information coming from the objects {or from the beam}, e.g. correction signals · CPC title

• H01J2237/30466

  Detecting endpoint of process · CPC title