Mass flow rate measurement method, thermal mass flow meter using said method, and thermal mass flow controller using said thermal mass flow meter
US-10514289-B2 · Dec 24, 2019 · US
US10895482B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10895482-B2 |
| Application number | US-201916724675-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 23, 2019 |
| Priority date | Dec 27, 2018 |
| Publication date | Jan 19, 2021 |
| Grant date | Jan 19, 2021 |
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To provide an MFC capable of improving an S/N ratio of a sensor signal even when a pressure difference between both sides of the MFC is small and a flow rate in the sensor flow path is low. Provided is a mass flow controller including a fluid flow path that allows a fluid to pass therethrough, a plurality of flow sensor units that measure a mass flow rate of the fluid, an adjusting valve that adjusts a flow rate of the fluid passing through the fluid flow path, and a control unit that controls a degree of open of the adjusting valve. The flow sensor units are each a thermal flow sensor unit. The control unit calculates a mass flow rate from an added output signal obtained by adding the output signals of the plurality of flow sensor units, and controls the degree of open of the adjusting valve.
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What is claimed is: 1. A mass flow controller comprising: a fluid flow path that allows a fluid to pass therethrough; a plurality of flow sensors that measure a mass flow rate of the fluid passing through the fluid flow path; an adjusting valve that adjusts a flow rate of the fluid passing through the fluid flow path; and a controller configured to control a degree of open of the adjusting valve so that the mass flow rate of the fluid measured by the flow sensors becomes a predetermined value, wherein the fluid flow path includes a bypass flow path constituting a portion thereof, the flow sensors each include a sensor flow path branching at a primary side of the bypass flow path and returning to the fluid flow path at a secondary side of the bypass flow path, heating resistors provided respectively on an upstream side and a downstream side in a middle of the sensor flow path, and a signal output part, and outputs a signal proportional to a difference between resistance values of the upstream side and downstream side heating resistors when energized, and the controller is configured to calculate a mass flow rate from an added output signal obtained by adding the output signals of the plurality of flow sensors, and to control the degree of open of the adjusting valve so that the mass flow rate becomes a predetermined value. 2. The mass flow controller according to claim 1 , wherein the plurality of flow sensors have substantially the same characteristics as sensors. 3. The mass flow controller according to claim 1 , further comprising: a body including a top surface and a bottom surface opposing each other, and side surfaces extending from the top surface toward the bottom surface side, wherein the fluid flow path is provided in a longitudinal direction in parallel with the bottom surface, and the plurality of flow sensors are disposed symmetrically with respect to a virtual center plane orthogonal to the bottom surface and extending in the longitudinal direction. 4. The mass flow controller according to claim 1 , wherein the controller is configured to add the output signals of the plurality of flow sensors in a digital signal state, and to calculate a mass flow rate on the basis of a digital signal obtained by the adding. 5. A fluid control system comprising a plurality of fluid devices arranged therein, wherein the plurality of fluid devices each include the mass flow controller as defined in claim 1 . 6. A semiconductor manufacturing system comprising the mass flow controller as defined in claim 1 to control a process gas in a manufacturing process of a semiconductor that requires a treatment process by the process gas in a sealed chamber.
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Valves (valves in general F16K) · CPC title
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