Interconnect module for both panel and mid board mounting

Patent metadata

Field	Value
Publication number	US-10892585-B2
Application number	US-201716345316-A
Country	US
Kind code	B2
Filing date	Oct 26, 2017
Priority date	Oct 26, 2016
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

First claim

What is claimed is:

1. An interconnect module configured to mate with a host module having a host substrate and first and second pluralities of electrical contacts supported by the host module, the interconnect module comprising:
an interconnect substrate that defines a top and bottom surfaces opposite each other along a transverse direction, and front and rear ends opposite each other along a longitudinal direction that is oriented substantially perpendicular to the transverse direction;
a plurality of first electrical lands carried by the bottom surface;
a plurality of second electrical lands carried by the bottom surface disposed such that the first electrical lands are spaced from the second electrical lands in a forward direction that is oriented along the longitudinal direction; and
a first guide member configured to engage a complementary second guide member so as to guide the interconnect module to mate with a host module in the forward direction such that 1) the first lands pass by the second electrical contacts while spaced from the second electrical contacts along the transverse direction, 2) the first lands mate with the first electrical contacts, and 3) the second lands mate with the second electrical contacts.

2. The interconnect module as recited in claim 1 , comprising a transceiver having an optical engine supported by the interconnect substrate.

3. The interconnect module as recited in claim 1 , wherein the first guide member comprises a recess that extends into a module housing of the interconnect module, the recess configured to receive the second guide member of the host module configured as a projection so as to guide movement of the interconnect module in the forward direction.

4. The interconnect module as recited in claim 3 , wherein the recess defines a first length, and a second length offset from the first length in both a rearward direction opposite the forward direction, and an upward direction away from the interconnect substrate.

5. The interconnect module as recited in claim 1 , further comprising a biasing member that is configured to urge the second electrical contacts from a first position whereby mating regions of the second electrical contacts are offset with respect to mating regions of the first electrical contacts in a downward direction toward the host substrate, to a second position that is substantially coplanar with the mating regions of the first electrical contacts after the first lands pass by the second electrical contacts.

6. An interconnect system comprising:
the interconnect module as recited in claim 1 ;
the host module as recited in claim 1 ; and
a cage configured to be supported by a panel, wherein the second guide member is carried by the cage.

7. The interconnect system as recited in claim 6 , wherein the first guide member is a recess defined by a module housing that extends from the interconnect substrate, and the second guide member comprises a projection that is carried by the cage and is sized to be received in the recess so as to guide motion of the interconnect module with respect to the host module.

8. An interconnect module comprising:
an interconnect substrate defining a top surface and a bottom surface spaced from the top surface along a transverse direction;
a module housing supported by the interconnect substrate, wherein the module housing substantially surrounds an optical engine mounted to the interconnect substrate;
a row of a first plurality of electrical lands supported by the bottom surface of the interconnect substrate;
a row of a second plurality of electrical lands supported by the bottom surface of the interconnect substrate at a location spaced from the row of the first plurality of electrical lands along a longitudinal direction that is substantially perpendicular to the transverse direction;
wherein the interconnect module is configured to selectively mate to a host module through a panel and to a mid board location of the host module.

9. The interconnect module as recited in claim 8 , further comprising a guide member configured to guide the interconnect module to mate with a host module through a cage, and a latch engagement member configured to receive a latch that secures the interconnect module to the host module when the interconnect module is mated to the host module at the mid board location.

10. The interconnect module as recited in claim 9 , wherein the guide member comprises a recess that extends into the module housing.

11. The interconnect module as recited in claim 9 , wherein the latch engagement member comprises a recess that extends into the module housing.

12. The interconnect module as recited in claim 9 , wherein the latch engagement member intersects the guide member.

13. The interconnect module as recited in claim 9 , wherein the guide member comprises a first length and a second length having at least a portion that is offset from the first length along both the transverse direction and the longitudinal direction.

14. The interconnect module as recited in claim 13 , wherein the guide member further comprises a jog that extends from the first length to the second length.

15. The interconnect module as recited in claim 14 , wherein the jog extends from a trailing end of the first length to a leading end of the second length.

16. The interconnect module as recited in claim 13 , wherein the first and second lengths are oriented substantially along the longitudinal direction.

17. The interconnect module as recited in claim 14 , wherein the jog is oriented substantially along the transverse direction.

18. The interconnect module as recited in claim 8 , wherein the row of a first plurality of electrical lands is spaced from the row of a second plurality of electrical lands in a forward direction that is oriented along the longitudinal direction, and the interconnect module is configured to mate to the host module such that the first electrical lands are configured to mate with a first plurality of electrical contacts without wiping along a second plurality of electrical contacts of the host module that are spaced from the first plurality of electrical contacts in a rearward direction that is opposite the forward direction.

19. An interconnect module configured to mate in a forward direction with a host module having a host substrate and first and second pluralities of electrical contacts supported by the host module, the interconnect module comprising:
an interconnect substrate that defines a top and bottom surfaces opposite each other along a transverse direction, and front and rear ends opposite each other along a longitudinal direction that is oriented substantially perpendicular to the transverse direction;
a plurality of first electrical lands carried by the bottom surface;
a plurality of second electrical lands carried by the bottom surface disposed such that the first electrical lands are spaced from the second electrical lands in the forward direction that is oriented along the longitudinal direction;
wherein the interconnect module is configured to mate with the host module mounted in either a panel mount position or mid board position.

20. The interconnect module as recited in claim 19 , wherein the first lands pass over electrical contacts of the host module without wiping against the electrical contacts and the second electrical lands mate with the electrical contacts.

Assignees

• Samtec Inc

Inventors

• Shah Jignesh
• Williams Barnett Jean Karlo
• Zbinden Eric

Classifications

• G02B6/4261 Primary

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title

• G02B6/4284

  of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627) · CPC title

• H01R13/631 Primary

  for engagement only · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• H01R13/6271

  Latching means integral with the housing (H01R13/6276, H01R13/6277, H01R13/6278 take precedence) · CPC title