Transceiver and interface for IC package

Patent metadata

Field	Value
Publication number	US-9374165-B2
Application number	US-201414295367-A
Country	US
Kind code	B2
Filing date	Jun 4, 2014
Priority date	Jul 1, 2011
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

First claim

What is claimed is:

1. An interconnect system comprising:
a host circuit board;
an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and
a transceiver including an optical engine arranged to convert optical signals into electrical signals or arranged to convert electrical signals into optical signals; wherein
the transceiver is arranged to mate and unmate with the first connector so that, when the transceiver is mated with the first connector, at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.

2. An interconnect system according to claim 1 , wherein the IC circuit board includes a plurality of solder balls arranged in a ball grid array.

3. An interconnect system according to claim 1 , further comprising a second connector connected directly to the host circuit board and arranged to connect the transceiver directly to the host circuit board so that at least some electrical signals are transmitted directly between the transceiver and the host circuit board.

4. An interconnect system according to claim 3 , wherein the second connector is a zero-insertion-force connector.

5. An interconnect system according to claim 3 , wherein the second connector includes a latch that is arranged to connect the transceiver to the second connector.

6. An interconnect system according to claim 3 , wherein the second connector includes a clip that is arranged to connect the transceiver to the second connector.

7. An interconnect system according to claim 3 , wherein the second connector and the transceiver are connected with a screw.

8. An interconnect system according to claim 1 , wherein the first connector is an edge-card connector.

9. An interconnect system according to claim 1 , wherein the transceiver further includes a heatsink.

10. An interconnect system according to claim 9 , wherein:
the transceiver further includes a transceiver circuit board; and
the heatsink includes a pair of legs that are arranged to connect the transceiver circuit board to the heat sink.

11. An interconnect system according to claim 9 , wherein:
the transceiver further includes a transceiver circuit board; and
the heatsink includes a pair of protrusions and a strap that are arranged to connect the transceiver circuit board to the heat sink.

12. An interconnect system according to claim 9 , wherein:
the transceiver further includes a transceiver circuit board; and
the heatsink includes a pair of opposing clips that are arranged to connect the transceiver circuit board to the heat sink.

13. An interconnect system according to claim 9 , wherein:
the transceiver further includes a transceiver circuit board; and
the transceiver is connected to the host circuit board with a screw.

14. An interconnect system according to claim 1 , wherein the IC package further includes a lid.

15. An interconnect system according to claim 14 , wherein the lid provides a heat path for the optical engine when the transceiver is mated with the first connector.

16. An interconnect system according to claim 1 , wherein the transceiver includes a cable through which the transceiver receives or transmits optical signals.

17. An interconnect system according to claim 16 , wherein the optical signals are converted to electrical signals and transmitted to the IC package through the first connector.

18. An interconnect system according to claim 17 , wherein the electrical signals are further transmitted to the IC die through the first connector and the IC circuit board.

19. An interconnect system according to claim 16 , wherein the electrical signals are transmitted directly to the host circuit board through a second connector connected to the host circuit board.

20. An interconnect system according to claim 1 , wherein the transceiver includes a cable through which the transceiver receives and transmits electrical signals.

21. An interconnect system according to claim 1 , wherein the IC package includes at least one additional first connector.

22. An interconnect system comprising:
a first circuit board;
first and second connectors connected to the first circuit board; and
a transceiver including an optical engine arranged to receive or transmit optical signals through a cable and arranged to convert optical signals received from the cable into electrical signals or to convert electrical signals received from the first connector into optical signals to be transmitted through the cable; wherein
the transceiver is arranged to mate and to unmate with the first and second connectors so that, when the transceiver is mated with the first connector, electrical signals are transmitted between the transceiver and the first connector and between the transceiver and the second connector.

23. An interconnect system according to claim 22 , wherein the first connector is connected to the first circuit board through a second circuit board.

24. An interconnect system according to claim 22 , wherein the transceiver is arranged to receive or transmit electrical signals through the cable.

25. An interconnect system according to claim 22 , wherein the cable is permanently attached to the transceiver.

26. A system comprising:
a host circuit board;
a package surface mounted to the host circuit board and including a first connector connected to the package but not connected to the host circuit board;
a second connector connected to the host circuit board but not connected to the package; and
a transceiver including:
a first interface arranged to mate with the first connector;
a second interface arranged to mate with the second connector;
a cable including at least one optical fiber; and
an optical engine arranged to convert at least some electrical signals received from the second connector into optical signals and to transmit the converted optical signals to the at least one optical fiber or arranged to convert optical signals received from the at least one optical fiber into electrical signals and to transmit the converted electrical signals to the second connector.

27. The system according to claim 26 , wherein the second connector provides mechanical retention for the transceiver.

28. The system according to claim 27 , wherein the second connector provides latching for the transceiver.

29. The system according to claim 26 , wherein the second connector provides electrical connections between the transceiver and the host circuit board without going through the package.

30. The system according to claim 26 , wherein the second connector provides electrical connections between the transceiver and the host circuit board without going through the package and provides mechanical retention.

31. A system according to claim 26 , wherein the transceiver further includes at least one copper cable.

32. The system according to claim 31 , wherein the second connector provides mechanical retention for the transceiver.

33. The system according to claim 31 , wherein the second connector provides latching for the transceiver.

34. The system according to claim 31 , wherein the second connector provides electrical connections between the transceiver and the host circuit board

Assignees

• Samtec Inc

Inventors

• Zbinden Eric
• Musser Randall
• Verdiell Jean-Marc André
• Mongold John
• Vicich Brian
• Guetig Keith

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title

• H04B10/803

  Free space interconnects, e.g. between circuit boards or chips · CPC title