Heat bonding of low energy surface substrates

Patent metadata

Field	Value
Publication number	US-10882292-B2
Application number	US-201615740202-A
Country	US
Kind code	B2
Filing date	Jul 6, 2016
Priority date	Jul 6, 2015
Publication date	Jan 5, 2021
Grant date	Jan 5, 2021

Abstract

A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

First claim

What is claimed is:

1. A method comprising:
providing a polymeric substrate, wherein the polymeric substrate has a melting point of from about 130° C. to about 190° C.;
locating a material layer onto the polymeric substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate;
exposing one or more of the polymeric substrate and the material layer to a stimulus so that a temperature is increased in a predetermined temperature zone of the one or more of the polymeric substrate and the material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate; and
wherein the material layer forms a foam upon exposure to the stimulus.

2. The method of claim 1 , wherein the stimulus comprises an electromagnetic field in a radio frequency or a medium frequency current.

3. The method of claim 1 , wherein the material layer comprises one or more of an ethylene component and a propylene component.

4. The method of claim 3 , wherein the stimulus activates the one or more of the ethylene component and the propylene component of the material layer.

5. The method of claim 3 , wherein the material layer includes a metallic filler.

6. The method of claim 5 , wherein the stimulus activates the metallic filler.

7. The method of claim 5 , wherein the metallic filler includes a combination of one or more of manganese zinc ferrite, iron ferrite, or nickel.

8. The method of claim 7 , wherein the metallic filler comprises manganese zinc ferrite.

9. The method of claim 7 , wherein the metallic filler comprises iron ferrite.

10. The method of claim 3 , wherein the material layer has adhesive properties.

11. The method of claim 3 , wherein the material layer is located in between an adhesive layer and the polymeric substrate.

12. The method of claim 3 , wherein the material layer comprises a polymer component and an epoxy component, whereby the polymer component blends with the polymeric substrate but the epoxy component does not.

13. The method of claim 3 , wherein the material layer is formed as a mesh.

14. The method of claim 1 , wherein the polymeric substrate comprises polypropylene.

15. The method of claim 1 , wherein the polymeric substrate is adhered to a second polymeric substrate via the material layer.

16. The method of claim 1 , wherein the material layer is a film.

17. The method of claim 1 , wherein the material layer contacts an adhesive layer that forms a foam layer upon exposure to the stimulus.

18. The method of claim 1 , wherein the polymeric substrate comprises polypropylene and the material layer comprises one or more of an ethylene component, whereby the one or more of the ethylene component liquefies upon exposure to the stimulus to blend with the polypropylene of the polymeric substrate.

19. The method of claim 18 , wherein the material layer includes a filler present in an amount of at least about 20% by weight of the material layer.

Assignees

• Zephyros Inc

Inventors

• Mazich Kenneth A
• Apfel Jeffrey R
• Makuch Kenneth S

Classifications

• B32B37/14

  characterised by the properties of the layers · CPC title

• B32B2310/0812

  using induction · CPC title

• B32B27/32

  comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

• B32B2264/105

  Metal · CPC title

• B32B2307/546

  Flexural strength; Flexion stiffness · CPC title