Heat bonding of low energy surface substrates
US-11577500-B2 · Feb 14, 2023 · US
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Patent family 56571354
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 56571354 |
| Family type | — |
| Earliest priority | Jul 6, 2015 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US11577500B2 — Heat bonding of low energy surface substrates |
Representative publication
Best representative member for this family based on priority and filing country.
US11577500B2 — Heat bonding of low energy surface substrates (published Feb 14, 2023)
Member publications
Related publications in this family.
Heat bonding of low energy surface substrates
US-2021094269-A1 · Apr 1, 2021 · US
Heat bonding of low energy surface substrates
US-10882292-B2 · Jan 5, 2021 · US
Heat bonding of low energy surface substrates
US-2018186141-A1 · Jul 5, 2018 · US