Circuit board and optical module having such circuit board

Patent metadata

Field	Value
Publication number	US-10880987-B2
Application number	US-201916527257-A
Country	US
Kind code	B2
Filing date	Jul 31, 2019
Priority date	Aug 1, 2018
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

First claim

What is claimed is:

1. A circuit board, comprising:
an upper surface;
a lower surface;
a first end surface connecting the upper surface and lower surface; and
a heat dissipation block,
wherein
the first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot,
the heat dissipation block has a first surface and a second surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board, the second surface being adjacent to the first surface and disposed in the same plane as the first end surface of the circuit board, and
the inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

2. The circuit board of claim 1 , wherein a protruding portion is arranged on at least one interior wall of the open slot, the heat dissipation block has a groove that matches the protruding portion, and the protruding portion forms the stop structure.

3. The circuit board of claim 2 , wherein the protruding portion of the open slot and the groove of the heat dissipation block are located below the first surface of the heat dissipation block.

4. The circuit board of claim 3 , wherein the protruding portion connects two side walls of the open slot.

5. The circuit board of claim 2 , wherein the protruding portion extends through the first surface of the heat dissipation block.

6. The circuit board of claim 1 , wherein an indentation is arranged on at least one interior wall of the open slot, the heat dissipation block has a protrusion that matches the indentation, and an interior wall of the indentation near the first end surface of the circuit board forms the stop structure.

7. The circuit board of claim 6 , wherein the indentation is disposed below the upper surface of the circuit board, or
the indentation extends through the upper surface of the circuit board.

8. The circuit board of claim 1 , wherein the first surface of the heat dissipation block is level with the upper surface of the circuit board.

9. The circuit board of claim 8 , wherein a conductive layer is arranged on the upper surface of the circuit board, the conductive layer covering the heat dissipation block,
an insulating dielectric layer and a secondary conductive layer are arranged on the conductive layer, and
a mounting area is formed on the conductive layer on the heat dissipation block, the mounting area extending to the first end surface.

10. The circuit board of claim 1 , wherein the upper surface of the circuit board is higher than the first surface of the heat dissipation block.

11. An optical module, comprises:
a first chip;
a second chip; and
the circuit board of claim 1 ,
wherein
the first chip is disposed on the heat dissipation block near the first end surface of the circuit board, and
the second chip is disposed on the side of the circuit board near the first end surface of the circuit board and the first chip.

12. The optical module of claim 11 , wherein
the upper surface of the circuit board is level with the first surface of the heat dissipation block,
a conductive layer is arranged on the upper surface of the circuit board, the conductive layer covering the heat dissipation block, an insulating dielectric layer and a secondary conductive layer being arranged on the conductive layer,
a mounting area is formed on the conductive layer on the heat dissipation block, the mounting area extending to the first end surface, and the first chip being disposed on the mounting area, and
the top secondary conductive layer is a signal layer, the signal layer being level with the upper surface of the first chip.

13. The optical module of claim 11 , wherein the upper surface of the circuit board is level with the upper surface of the first chip.

Assignees

• Innolight Tech Suzhou Ltd

Inventors

• Fang Xigui
• Wang Zhenzhong
• Yu Dengqun
• Wang Zhanwei
• Zhu Shuming

Classifications

• H05K2201/09163

  Slotted edge · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K2201/09063

  Holes or slots in insulating substrate not used for electrical connections · CPC title