Electronic component and method of manufacturing same

Patent metadata

Field	Value
Publication number	US-10879005-B2
Application number	US-201715613498-A
Country	US
Kind code	B2
Filing date	Jun 5, 2017
Priority date	Dec 10, 2014
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.

First claim

The invention claimed is:

1. An electronic component comprising:
an element body having a circuit element therein; and
a terminal formed on the element body,
wherein the terminal is formed over an end surface and a surface adjacent to the end surface of the element body and a first plating film not containing tin is formed on the terminal,
wherein an insulating film covering the terminal on which the first plating film is formed is formed on the element body,
wherein the first plating film of the terminal is exposed from the insulating film at least on a mounting surface of the element body, and
wherein a second plating film containing tin is formed on the first plating film exposed from the insulating film.

2. The electronic component according to claim 1 , wherein the element body has a second circuit element formed therein by laminating an insulator layer and a conductor pattern.

3. The electronic component according to claim 1 , wherein the element body has a coil formed therein by laminating insulator layers and conductor patterns and helically connecting the conductor patterns between the insulator layers.

4. The electronic component according to claim 1 , wherein the element body includes a coil therein formed by winding a conductive wire.

5. An electronic component comprising:
an element body having a circuit element therein; and
a terminal formed on the element body,
wherein the terminal is formed over an end surface and a surface adjacent to the end surface of the element body and a first plating film not containing tin is formed on the terminal,
wherein an insulating film covering the terminal on which the first plating film is formed is formed on the element body,
wherein the insulating film has a removed part formed at least on a mounting surface of the element body, and the first plating film is exposed from the insulating film, and
wherein a second plating film containing tin is formed on the first plating film at the removed part.

6. The electronic component according to claim 5 , wherein the element body is entirely covered with the insulating film.

7. The electronic component according to claim 5 , wherein the removed part is formed over the mounting surface and a surface other than the mounting surface of the element body.

8. The electronic component according to claim 5 , wherein the element body has a second circuit element formed therein by laminating an insulator layer and a conductor pattern.

9. The electronic component according to claim 5 , wherein the element body has a coil formed therein by laminating insulator layers and conductor patterns and helically connecting the conductor patterns between the insulator layers.

10. The electronic component according to claim 5 , wherein the element body includes a coil therein formed by winding a conductive wire.

11. A method of manufacturing an electronic component including an element body having a circuit element therein and a terminal formed on the element body, the method comprising the steps of:
forming an element body having a circuit element therein and forming a terminal on the element body, and forming a first plating film not containing tin;
forming an insulating film on the element body to cover the terminal on which the first plating film is formed;
removing the insulating film to form a removed part in which the first plating film of the terminal is exposed on a bottom surface; and
applying plating to form a second plating film containing tin on the first plating film at the removed part.

12. The method of manufacturing an electronic component according to claim 11 , wherein when the insulating film is formed, the element body is entirely covered with the insulating film.

13. The method of manufacturing an electronic component according to claim 11 , wherein the removed part is formed on a mounting surface of the element body.

14. The method of manufacturing an electronic component according to claim 11 , wherein the removed part is formed over a mounting surface and a surface other than the mounting surface of the element body.

15. A method of manufacturing an electronic component including an element body having a circuit element therein and a terminal formed on the element body, the method comprising the steps of:
forming an element body having a circuit element therein, forming a terminal on the element body, and forming a first plating film not containing tin on the terminal;
forming an insulating film on the element body;
removing the insulating film to expose the first plating film of the terminal; and
forming a second plating film containing tin on the first plating film of the terminal exposed from the insulating film.

Assignees

• Murata Manufacturing Co

Inventors

• Maki Yoshifumi
• Tomioka Hirotsugu
• Izumi Shinichiro
• Iso Eiji

Classifications

• H01G4/252

  the terminals being coated on the capacitive element (H01G4/232 takes precedence) · CPC title

• H01F27/29

  Terminals; Tapping arrangements {for signal inductances} · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01F27/02

  Casings · CPC title

• H01F17/0013

  with stacked layers · CPC title