Imprinted metallization on polymeric substrates

Patent metadata

Field	Value
Publication number	US-10874020-B2
Application number	US-201916271261-A
Country	US
Kind code	B2
Filing date	Feb 8, 2019
Priority date	Feb 8, 2019
Publication date	Dec 22, 2020
Grant date	Dec 22, 2020

Abstract

A method for selective metallization includes: selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold; using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film; separating the film from the SACN mold; and selectively depositing metal onto the film based on the pattern transferred to the film.

First claim

The invention claimed is:

1. A method for selective metallization, the method comprising:
selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold;
using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film;
separating the film from the SACN mold; and
selectively depositing metal onto the film based on the pattern transferred to the film.

2. The method according to claim 1 , wherein the imprint mold comprises microscale and/or nanoscale structures corresponding to the pattern.

3. The method according to claim 1 , wherein the pattern is a mesh pattern.

4. The method according to claim 1 , wherein the pattern corresponds to a nanodisk array.

5. The method according to claim 1 , wherein the imprint mold comprises a glass backbone, a resin interlayer, and a metal layer.

6. The method according to claim 5 , wherein the metal layer comprises nickel (Ni).

7. The method according to claim 5 , wherein the metal layer corresponds to the pattern.

8. The method according to claim 5 , wherein the metal layer is adsorptive relative to the nanoparticles and the resin interlayer is repellent relative to the nanoparticles.

9. The method according to claim 1 , wherein the nanoparticles comprise palladium nanoparticles (PdNPs), platinum nanoparticles, silver nanoparticles, nickel nanoparticles or nickel-cobalt nanoparticles.

10. The method according to claim 1 , wherein selectively adsorbing catalytic nanoparticles onto the imprint mold to form the SACN mold comprises immersing the imprint mold in a nanoparticle solution.

11. The method according to claim 1 , wherein the film is a thermoplastic film.

12. The method according to claim 1 , wherein selectively depositing metal onto the film based on the pattern transferred to the film comprises:
immersing the film in one or more electroless plating baths.

13. The method according to claim 1 , further comprising:
forming the imprint mold, wherein forming the imprint mold comprises:
coating a resist film onto a first glass substrate;
generating the pattern in the resist film;
depositing an adsorptive metal based on the pattern;
forming a resin interlayer and a glass backbone by adding a resin and covering the resin with a second glass substrate;
removing the first glass substrate and the resist film.

14. The method according to claim 13 , wherein forming the imprint mold further comprises:
curing the resin interlayer.

15. The method according to claim 13 , wherein the resist film is a photoresist film, and wherein generating the pattern in the resist film comprises a lithographic process.

16. The method according to claim 13 , wherein forming the imprint mold further comprises:
baking the imprint mold.

Assignees

• Univ Hong Kong

Inventors

• Li Wendi
• Cai Jingxuan
• Feng Shien-Ping
• Zhang Mingyang

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/833

  Transparent materials · CPC title

• H10H20/823

  comprising only Group II-VI materials, e.g. ZnO · CPC title

• H10H20/032

  of electrodes · CPC title

• H10H20/012

  having light-emitting regions comprising only Group II-IV materials · CPC title