Flexible hybrid interconnect circuits

Patent metadata

Field	Value
Publication number	US-10874015-B2
Application number	US-202016850340-A
Country	US
Kind code	B2
Filing date	Apr 16, 2020
Priority date	Oct 29, 2018
Publication date	Dec 22, 2020
Grant date	Dec 22, 2020

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

First claim

What is claimed is:

1. A flexible hybrid interconnect circuit comprising: a first strip; a second strip; a third strip, such that the first strip is positioned between the second strip and the third strip; a first circuit opening, disposed between and partially separates the first strip and the second strip; a second circuit opening, disposed between and partially separates the first strip and the third strip, wherein the first circuit opening and the second circuit opening are configured for in-plane bending of the flexible hybrid interconnect circuit, and wherein the first circuit opening and the second circuit opening have different lengths and at least partially overlap with each other along a length of the flexible hybrid interconnect circuit; a first outer dielectric, comprising first dielectric openings, corresponding to the first circuit opening and the second circuit opening; a second outer dielectric, comprising second dielectric openings, corresponding to the first circuit opening and the second circuit opening; a signal transmission portion, disposed between the first outer dielectric and the second outer dielectric and comprising a first signal line, disposed within the first strip and between the first circuit opening and the second circuit opening; and a power transmission portion, disposed between the first outer dielectric and the second outer dielectric and offset relative to the signal transmission portion along a width of the flexible hybrid interconnect circuit.

2. The flexible hybrid interconnect circuit of claim 1 , wherein the signal transmission portion further comprises a first shield, offset relative to the first signal line along a thickness of the flexible hybrid interconnect circuit.

3. The flexible hybrid interconnect circuit of claim 2 , wherein the first shield of the signal transmission portion comprises a first shield opening, partially overlapping with the first circuit opening.

4. The flexible hybrid interconnect circuit of claim 3 , wherein the first shield of the signal transmission portion comprises a first additional shield opening, partially overlapping the second circuit opening.

5. The flexible hybrid interconnect circuit of claim 2 , wherein the signal transmission portion further comprises a second shield, offset relative to the first signal line along a thickness of the flexible hybrid interconnect circuit such that the first signal line is positioned between the first shield and the second shield.

6. The flexible hybrid interconnect circuit of claim 5 , wherein the second shield of the signal transmission portion comprises a second shield opening, partially overlapping with the first circuit opening.

7. The flexible hybrid interconnect circuit of claim 5 , wherein the signal transmission portion further comprises a third shield and a fourth shield, wherein the first signal line is disposed between the third shield and the fourth shield along a width of the flexible hybrid interconnect circuit.

8. The flexible hybrid interconnect circuit of claim 7 , wherein the third shield and the fourth shield are disposed within the first strip and between the first circuit opening and the second circuit opening.

9. The flexible hybrid interconnect circuit of claim 7 , wherein each of the third shield and the third shield is disposed between the first shield and the second shield along the thickness of the flexible hybrid interconnect circuit.

10. The flexible hybrid interconnect circuit of claim 2 , wherein the first signal line is electrically insulated from the first shield.

11. The flexible hybrid interconnect circuit of claim 1 , further comprising: a first inner dielectric, disposed between the first signal line and the first outer dielectric; and a second inner dielectric, disposed between the first signal line and the second outer dielectric.

12. The flexible hybrid interconnect circuit of claim 11 , wherein at least one of the first inner dielectric and the second inner dielectric comprises crosslinked low density polyethylene (LDPE).

13. The flexible hybrid interconnect circuit of claim 11 , wherein at least one the first inner dielectric or the second inner dielectric comprises a flame retardant.

14. The flexible hybrid interconnect circuit of claim 1 , further comprising: an interconnect hub, connected to the first signal line; and a second signal line, connected to the interconnect hub, wherein the interconnect hub is configured to selective connect and disconnect the first signal line and the second signal line.

15. The flexible hybrid interconnect circuit of claim 14 , further comprising a third signal line, connected to the interconnect hub, wherein the interconnect hub is configured to selective connect and disconnect the first signal line and either one of the second signal line or the third signal line.

16. The flexible hybrid interconnect circuit of claim 15 , wherein the interconnect hub is remotely controlled using one of the first signal line, the second signal line, or the third signal line.

17. The flexible hybrid interconnect circuit of claim 14 , wherein the interconnect hub is one of a field programmable gate array (FPGA), a controller, or a computer chip.

18. The flexible hybrid interconnect circuit of claim 14 , wherein the second signal line is disposed in one of the second strip or the third strip.

Assignees

• Celllink Corp
• Cellink Corp

Inventors

• Coakley Kevin Michael
• Brown Malcolm Parker
• Juarez Jose
• Hernandez Emily
• Pratt Joseph
• Stone Peter
• Viswanath Vidya
• Findlay Will

Classifications

• H05K3/4084

  by deforming at least one of the conductive layers · CPC title

• H05K1/0219 Primary

  Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors · CPC title

• H01B7/0861

  comprising one or more screens · CPC title

• H01B7/0838

  Parallel wires, sandwiched between two insulating layers · CPC title

• H05K2201/10401

  Eyelets, i.e. rings inserted into a hole through a circuit board · CPC title