Method for producing luminescent particles with a protective layer and luminescent particles having a protective layer

Patent metadata

Field	Value
Publication number	US-10865478-B2
Application number	US-201716079280-A
Country	US
Kind code	B2
Filing date	Mar 1, 2017
Priority date	Mar 8, 2016
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

A method for producing phosphor particles with at least one first protective layer and a phosphor particles having at least one protective layer are disclosed. In an embodiment, a method includes providing phosphor particles and applying at least one first protective layer to the surface of the phosphor particles, wherein the at least of first protective layer include depositing a first starting compound by a first atomic layer deposition on the surface of the phosphor particles and depositing a second starting compound by a second atomic layer deposition on the surface of the phosphor particles.

First claim

The invention claimed is:

1. A method for producing phosphor particles with at least one first protective layer, the method comprising:
providing the phosphor particles; and
applying the at least one first protective layer to a surface of the phosphor particles, wherein the at least one first protective layer comprises:
depositing a first starting compound by a first atomic layer deposition on the surface of the phosphor particles; and
depositing a second starting compound by a second atomic layer deposition on the surface of the phosphor particles,

wherein a phosphor of the phosphor particles has the general formula:
Sr(Sr a M 1−a )Si 2 Al 2 (N,X) 6 :Z,
wherein Z is selected from the group consisting of D, A, B, E, G, L and combinations thereof,
wherein M is selected from the group consisting of Ca, Ba, Mg alone and combinations thereof,
wherein D is selected from one, two or more elements from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Li, Na, K, Rb, Cs, Tm and Yb,
wherein A is selected from divalent metals which are different from M and D,
wherein B=trivalent metals,
wherein E=monovalent metals,
wherein G=tetravalent elements,
wherein L=trivalent elements, and
wherein X=O or halogen and 0.6≤a<1.

2. The method according to claim 1 , wherein the first starting compound is selected form the group consisting of organometallic compounds and metal halides, and wherein the second starting compound is selected form the group consisting of H 2 O, H 2 S, NH 3 and O 3 .

3. The method according to claim 2 , wherein the metal of the organometallic compound or of the metal halide is selected from the group consisting of boron, aluminum, silicon, tin, zinc, titanium, zirconium, tantalum, niobium and hafnium.

4. The method according to claim 1 , wherein the first starting compound comprises MCI x , MBr x , M(CH 3 ) x , M(CH 2 —CH 3 ) x , M(CH 2 —CH 2 —CH 3 ) x , M(OCH 3 ) x , M(OCH 2 —CH 3 ) x or M(OCH 2 —CH 2 —CH 3 ) x , and wherein M is one of B, Al, Si, Sn, Zn, Ti, Zr, Ta, Nb or Hf, and x corresponds to a valence of M.

5. The method according to claim 1 , wherein the first starting compound comprises AlCl 3 , AlBr 3 , Al(CH 3 ) 3 , Al(CH 2 —CH 3 ) 3 , Al(CH 2 —CH 2 —CH 3 ) 3 , Al(OCH 3 ) 3 , Al(OCH 2 —CH 3 ) 3 or Al(OCH 2 —CH 2 —CH 3 ) 3 .

6. The method according to claim 1 , wherein several first protective layers are applied to the surface of the phosphor particles such that the surface of the phosphor particles is coated with a plurality of first protective layers.

7. The method according to claim 1 , further comprising, after applying the at least one first protective layer to the surface of the phosphor particles, tempering the phosphor particles coated with the at least one first protective layer at a temperature between 200° C. and 500° C.

8. The method according to claim 7 , wherein tempering the phosphor particles comprises tempering the phosphor particles under an inert gas atmosphere, an oxygen-containing atmosphere or an H 2 —containing atmosphere.

9. The method according to claim 7 , wherein tempering the phosphor particles coated with the at least one first protective layer comprises tempering with an oxygen-containing atmosphere or an H 2 —containing atmosphere.

10. The method according to claim 1 , further comprising, before applying the at least one first protective layer to the surface of the phosphor particles, treating the phosphor particles with an acid solution, wherein a pH of the acid solution is kept within a range of pH 3.5 to 7 for a period of at least 1 h.

11. The method according to claim 10 , after treating the phosphor particles with the acid solution, tempering the treated phosphor particles at a temperature of at least 100° C.

12. The method according to claim 10 , wherein a Si-containing second protective layer is formed on the surface of the phosphor particles, the second protective layer having a higher content of Si than the phosphor particles.

13. The method according to claim 12 , after treating the phosphor particles with the acid solution, tempering the treated phosphor particles at a temperature of at least 100° C.

14. The method according to claim 10 , wherein an Al-containing second protective layer is formed on the surface of the phosphor particles, the second protective layer having a modified content of aluminum on the surface compared with the phosphor particles.

15. The method according to claim 14 , after treating the phosphor particles with the acid solution, tempering the treated phosphor particles at a temperature of at least 100° C.

16. The method according to claim 1 , wherein the phosphor has the general formula: Sr(Sr a M 1−a )Si 2 Al 2 N 6 :D, wherein M is selected from the group consisting of Ca, Ba, Zn and Mg, and wherein D Eu.

17. A method for producing phosphor particles with at least one first protective layer, the method comprising:
providing the phosphor particles; and
applying the at least one first protective layer to a surface of the phosphor particles, wherein the at least one first protective layer comprises:
depositing a first starting compound by a first atomic layer deposition on the surface of the phosphor particles; and
depositing a second starting compound by a second atomic layer deposition on the surface of the phosphor particles,

wherein a phosphor of the phosphor particles has the general formula: Sr(Sr a M 1−a )Si 2 Al 2 N 6 :D, wherein M is selected from the group consisting of Ca, Ba, Zn and Mg, and wherein D is selected from the group consisting of Eu and Ce.

18. The method according to claim 17 , wherein the first starting compound is selected form the group consisting of organometallic compounds and metal halides, and wherein the second starting compound is selected form the group consisting of H 2 O, H 2 S, NH 3 and O 3 .

19. The method according to claim 18 , wherein the metal of the organometallic compound or of the metal halide is selected from the group consisting of boron, aluminum, silicon, tin, zinc, titanium, zirconium, tantalum, niobium and hafnium.

20. The method according to claim 17 , wherein D is Ce.

Assignees

• Osram Opto Semiconductors Gmbh
• Osram Oled Gmbh

Inventors

• Tragl Sonja
• Fiedler Tim
• Jermann Frank

Classifications

• C09K11/77348

  Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides · CPC title

• C23C16/56

  After-treatment · CPC title

• C23C16/50

  using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)} · CPC title

• C23C16/45525

  Atomic layer deposition [ALD] · CPC title

• C23C16/4417 Primary

  Methods specially adapted for coating powder · CPC title