Electronic component mounting method

Patent metadata

Field	Value
Publication number	US-10863657-B2
Application number	US-201414768912-A
Country	US
Kind code	B2
Filing date	Feb 20, 2014
Priority date	Feb 22, 2013
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

An electronic component mounting method is performed by an electronic component mounting system including a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The electronic component mounting method comprises mixedly distributing the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.

First claim

The invention claimed is:

1. An electronic component mounting method performed by an electronic component mounting system that comprises:
a screen printing apparatus including a first screen printing unit and a second screen printing unit to print solder paste on at least two kinds of boards including a first kind of boards and a second kind of boards, the first kind of boards and the second kind of boards having different component mounting densities,
a printing inspection apparatus to execute predetermined printing inspection on the at least two kinds of boards, and
a component mounting line formed by interconnecting a plurality of component mounting apparatuses concurrently performing component mounting work to mount an electronic component on the at least two kinds of boards,
wherein the first screen printing unit comprises a first carrying conveyor which conveys the first kind of boards, and the second screen printing unit comprises a second carrying conveyor which conveys the second kind of boards,
wherein the printing inspection apparatus comprises a single inspection conveyor which conveys the at least two kinds of boards, and an inspection head,
wherein each of the component mounting apparatuses comprises:
a first board conveyance mechanism and a second board conveyance mechanism, each of which comprises a board holding unit which conveys the board delivered from an upstream-side apparatus in a board conveyance direction and positions and holds the conveyed board;
a component mounting unit which executes the component mounting work by picking up the electronic component fed by a component feeding unit and transfers and mounts the picked-up electronic component onto the board held by the board holding unit;
a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and

a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit,
said electronic component mounting method comprising:
exclusively conveying the first kind of boards to the first carrying conveyor, and exclusively conveying the second kind of boards to the second carrying conveyor,
printing solder paste on the first kind of boards in the first screen printing unit, and printing solder paste on the second kind of boards in the second screen printing unit,
conveying the first kind of boards from the first carrying conveyor to the single inspection conveyor, and conveying the second kind of boards from the second carrying conveyor to the single inspection conveyor,
inspecting the first kind of boards and the second kind of boards with the inspection head, and
conveying at least one of the first kind of boards and at least one of the second kind of boards from the single inspection conveyor to the first board conveyance mechanism and conveying at least another one of the first kind of boards and at least another one of the second kind of boards from the single inspection conveyor to the second board conveyance mechanism based on a board request signal issued from a most-upstream component mounting unit in the component mounting line,
wherein said electronic component mounting method further comprises:
imaging a recognition mark formed in each of the two kinds of the boards with a component recognition camera;
recognizing the recognition mark based on a result of the imaging to thereby identify the kinds of the boards; and
changing over first mounting data and second mounting data from one to the other based on an identification result of the board to thereby control the component mounting unit, the first mounting data and the second mounting data being stored in a storage unit and being provided for mounting the electronic component on the two kinds of the boards, respectively.

2. The electronic component mounting method according to claim 1 ,
wherein the component feeding unit comprises a first component feeding unit and a second component feeding unit which are disposed on outer sides of the first board conveyance mechanism and the second board conveyance mechanism, respectively, and
wherein the component mounting unit comprises a first component mounting mechanism and a second component mounting mechanism which are provided correspondingly to the first board conveyance mechanism and the second board conveyance mechanism, respectively,
said electronic component mounting method comprising:
causing the first component mounting mechanism to pick up the electronic component from the first component feeding unit, and mount the electronic component on the board positioned by the first board conveyance mechanism, and
causing the second component mounting mechanism to pick up the electronic components from the second component feeding unit, and mount the electronic component on the board positioned by the second board conveyance mechanism.

3. The electronic component mounting method according to claim 1 ,
wherein the at least one of the first kind of boards and the at least one of the second kind of boards are alternately conveyed to the first board conveyance mechanism, and the at least another one of the first kind of boards and the at least another one of the second kind of boards are alternately conveyed to the second board conveyance mechanism.

4. The electronic component mounting method according to claim 1 ,
wherein the recognition mark includes a first recognition mark placed on a first surface of each of the at least two kinds of boards, and a second recognition mark placed on a second surface of each of the at least two kinds of boards opposite to the first surface.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Higashi Masayuki
• Mori Taisuke
• Kouchi Ryouji
• Yamazaki Takuya
• Maezono Hisashi
• Ando Hiroshi

Classifications

• H05K13/0061 Primary

  Tools for holding the circuit boards during processing; handling transport of printed circuit boards · CPC title

• H05K13/085

  Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level · CPC title

• B65G15/12

  with two or more endless belts · CPC title

• B65G15/24

  in tandem · CPC title

• B65G15/22

  comprising a series of co-operating units · CPC title