Fabrication of correlated electron material devices
US-9627615-B1 · Apr 18, 2017 · US
US10854814B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10854814-B2 |
| Application number | US-201816195779-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 19, 2018 |
| Priority date | Jul 5, 2016 |
| Publication date | Dec 1, 2020 |
| Grant date | Dec 1, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Subject matter disclosed herein may relate to fabrication of correlated electron materials used, for example, to perform a switching function. In embodiments, a correlated electron material may be doped using dopant species derived from one or more precursors utilized to fabricate nearby structures such as, for example, a conductive substrate or a conductive overlay.
Opening claim text (preview).
What is claimed is: 1. A switching device, comprising: an electrode to comprise at least one layer of electrically conductive material to include a particular dopant species; and a correlated electron switch to comprise at least one layer of correlated electron material formed over the electrode, wherein the correlated electron material to comprise the particular dopant species, and wherein the correlated electron material to comprise an electron back-donating material. 2. The switching device of claim 1 , wherein the particular dopant species to operate to fill oxygen vacancies in the electron back-donating material. 3. The switching device of claim 1 , wherein a concentration of the electron back-donating material to comprise an atomic concentration of between 0.1% and 10.0%. 4. The switching device of claim 1 , wherein the correlated electron material to comprise nickel oxide. 5. The switching device of claim 4 , wherein the electrically conductive material to comprise titanium nitride, tantalum nitride or tungsten nitride, or any combination thereof. 6. The switching device of claim 1 , wherein the particular dopant species to comprise carbon, chlorine, nitrogen, fluorine, cyanide (CN), nitrosyl (NO), ammonia (NH3), oxynitride molecules (NxOy, wherein x and y comprise whole numbers and wherein x>0 and y>0) or molecules of the form CxHyNz (wherein x>0, y>0, z>0), or any combination thereof. 7. The switching device of claim 1 , wherein the correlated electron material further to comprise an additional dopant species, wherein the electrically conductive material to further comprise the additional dopant species. 8. A switching device, comprising: an electrically conductive substrate; a correlated electron material deposited over the electrically conductive substrate; and an electrically conductive overlay deposited over the correlated electron material, wherein the correlated electron material to comprise a particular dopant species, wherein the correlated electron material to comprise an electron back-donating material, and wherein the electrically conductive substrate or the electrically conductive overlay, or a combination thereof, to comprise the particular dopant species. 9. The switching device of claim 8 , wherein the particular dopant species to comprise nitrogen, chlorine or carbon, or any combination thereof. 10. The switching device of claim 8 , wherein the particular dopant species to operate to fill oxygen vacancies in the correlated electron material. 11. The switching device of claim 8 , wherein the electrically conductive substrate to comprise titanium nitride, tantalum nitride or tungsten nitride, or any combination thereof. 12. The switching device of claim 8 , wherein the correlated electron material to comprise nickel oxide. 13. The switching device of claim 8 , wherein the correlated electron material to comprise a concentration of the electron back-donating material having an atomic concentration of between 0.1% and 10.0%. 14. The switching device of claim 8 , wherein the electrically conductive overlay to comprise titanium nitride, tantalum nitride or tungsten nitride, or any combination thereof. 15. The switching device of claim 8 , wherein the particular dopant species to comprise carbon, chlorine, nitrogen, fluorine, cyanide (CN), nitrosyl (NO), ammonia (NH3), oxynitride molecules (NxOy, wherein x and y comprise whole numbers and wherein x>0 and y>0) or molecules of the form CxHyNz (wherein x>0, y>0, z>0), or any combination thereof. 16. The switching device of claim 8 , wherein the correlated electron material further to comprise an additional dopant species, wherein the electrically conductive substrate or the electrically conductive overlay, or a combination thereof, further to comprise the additional dopant species.
by diffusion, e.g. photo-dissolution · CPC title
Devices using Mott metal-insulator transition, e.g. field-effect transistor-like devices · CPC title
Electrodes · CPC title
Multistable switching devices, e.g. memristors · CPC title
Oxides or nitrides · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.