Heat pipe

US10845128B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10845128-B2
Application numberUS-201815896578-A
CountryUS
Kind codeB2
Filing dateFeb 14, 2018
Priority dateApr 21, 2017
Publication dateNov 24, 2020
Grant dateNov 24, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat pipe includes an inlet port. The inlet port includes an unsealed part and a sealed part that include metal layers that are a first outermost layer, intermediate layers stacked on the first outermost layer, and a second outermost layer stacked on the intermediate layers. In the unsealed part, the intermediate layers include respective openings and respective first and second walls on first and second opposite sides, respectively, of the openings. The openings form an injection channel defined by the first and second outermost layers and the first and second walls of the intermediate layers. The inner wall faces of the first walls and the inner wall faces of the second walls of at least two adjacent intermediate layers form a first step and a second step, respectively. In the sealed part, each metal layer contacts one or more of other metal layers to hermetically seal the inlet port.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat pipe comprising: an evaporator configured to vaporize a working fluid; a condenser configured to condense the vaporized working fluid; a liquid pipe connecting the evaporator and the condenser; a vapor pipe connecting the evaporator and the condenser, the vapor pipe forming a loop with the liquid pipe; and an inlet port for injecting the working fluid, the inlet port protruding from a wall of the liquid pipe or the vapor pipe, the inlet port including an unsealed part and a sealed part that connect to each other, the unsealed part and the sealed part including a plurality of metal layers, the plurality of metal layers being a first outermost layer, a plurality of intermediate layers stacked on the first outermost layer, and a second outermost layer stacked on the plurality of intermediate layers, wherein, in the unsealed part, the plurality of intermediate layers include respective openings open to the first and second outermost layers, and respective first and second walls on first and second opposite sides, respectively, of the openings, the openings of the plurality of intermediate layers form an injection channel defined by the first and second outermost layers and the first and second walls of the plurality of intermediate layers, and inner wall faces of the first walls and inner wall faces of the second walls of at least two adjacent intermediate layers among the plurality of intermediate layers form a first step and a second step, respectively, and wherein, in the sealed part, each of the plurality of metal layers contacts one or more of other metal layers among the plurality of metal layers to hermetically seal the inlet port. 2. The heat pipe as claimed in claim 1 , wherein, in the unsealed part, the plurality of intermediate layers include a first intermediate layer and a second intermediate layer that are adjacent to each other, the first intermediate layer being closer to the first outermost layer than is the second intermediate layer, a distance between the first and second walls of the second intermediate layer is greater than a distance between the first and second walls of the first intermediate layer, the plurality of intermediate layers include a third intermediate layer and a fourth intermediate layer that are adjacent to each other, the third intermediate layer being closer to the first outermost layer than is the fourth intermediate layer, and a distance between the first and second walls of the fourth intermediate layer is smaller than a distance between the first and second walls of the third intermediate layer. 3. The heat pipe as claimed in claim 1 , wherein outer wall faces of at least two adjacent metal layers among the plurality of metal layers form a step. 4. A heat pipe comprising: an evaporator configured to vaporize a working fluid; a condenser configured to condense the vaporized working fluid; a liquid pipe connecting the evaporator and the condenser; a vapor pipe connecting the evaporator and the condenser, the vapor pipe forming a loop with the liquid pipe; and an inlet port for injecting the working fluid, the inlet port protruding from a wall of the liquid pipe or the vapor pipe, the inlet port including an unsealed part and a sealed part that connect to each other, the unsealed part and the sealed part including a plurality of metal layers, the plurality of metal layers being a first outermost layer, a plurality of intermediate layers stacked on the first outermost layer, and a second outermost layer stacked on the plurality of intermediate layers, wherein, in the unsealed part, the plurality of intermediate layers include respective openings open to the first and second outermost layers, and respective first and second walls on first and second opposite sides, respectively, of the openings, and the openings of the plurality of intermediate layers form an injection channel defined by the first and second outermost layers and the first and second walls of the plurality of intermediate layers, wherein, in the sealed part, each of the plurality of metal layers contacts one or more of other metal layers among the plurality of metal layers to hermetically seal the inlet port, and wherein the inlet port includes at least three regions that are different in a number of interfaces of metal layers in a stacking direction of the plurality of metal layers, the at least three regions being arranged in a direction perpendicular to the stacking direction. 5. The heat pipe as claimed in claim 4 , wherein, in the unsealed part, the plurality of intermediate layers include a first intermediate layer and a second intermediate layer that are adjacent to each other, the first intermediate layer being closer to the first outermost layer than is the second intermediate layer, a distance between the first and second walls of the second intermediate layer is greater than a distance between the first and second walls of the first intermediate layer, the plurality of intermediate layers include a third intermediate layer and a fourth intermediate layer that are adjacent to each other, the third intermediate layer being closer to the first outermost layer than is the fourth intermediate layer, and a distance between the first and second walls of the fourth intermediate layer is smaller than a distance between the first and second walls of the third intermediate layer. 6. The heat pipe as claimed in claim 4 , wherein outer wall faces of at least two adjacent metal layers among the plurality of metal layers form a step.

Assignees

Inventors

Classifications

  • in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} · CPC title

  • with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

  • Heat pipes · CPC title

  • characterised by the material or the construction of the capillary structure · CPC title

  • Means for filling or sealing heat pipes · CPC title

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What does patent US10845128B2 cover?
A heat pipe includes an inlet port. The inlet port includes an unsealed part and a sealed part that include metal layers that are a first outermost layer, intermediate layers stacked on the first outermost layer, and a second outermost layer stacked on the intermediate layers. In the unsealed part, the intermediate layers include respective openings and respective first and second walls on firs…
Who is the assignee on this patent?
Shinko Electric Ind Co
What technology area does this patent fall under?
Primary CPC classification F28D15/0266. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Nov 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).