Information carrying card comprising a cross-linked polymer composition, and method of making the same

US10836894B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10836894-B2
Application numberUS-201916515402-A
CountryUS
Kind codeB2
Filing dateJul 18, 2019
Priority dateApr 3, 2012
Publication dateNov 17, 2020
Grant dateNov 17, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

First claim

Opening claim text (preview).

What is claimed is: 1. A core layer for an information carrying card, comprising a thermoplastic layer defining at least one cavity therein; an inlay layer comprising at least one electronic component, the at least one electronic component partially or fully disposed inside the at least one cavity; and a crosslinked polymer composition disposed in the at least one cavity and contacting the at least one electronic component, the crosslinked polymer composition comprising: a base polymer resin selected from the group consisting of urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy, wherein the crosslinked polymer composition at least partially defines an outer surface of the core layer, the inlay layer is fully embedded inside the crosslinked polymer composition, and the outer surface of the core layer is an upper surface of the core layer opposite to a bottom surface of the thermoplastic layer. 2. The core layer of claim 1 wherein each cavity of the at least one cavity has a respective continuous surface profile solely defined by and inside the thermoplastic layer, the continuous surface profile having a respective bottom wall surface and a respective side wall surface. 3. The core layer of claim 1 wherein the inlay layer comprises a supporting film, and the at least one electronic component is embedded or mounted on the supporting film. 4. The core layer of claim 1 wherein the thermoplastic layer comprises a material selected from the group consisting of polyvinyl chloride, copolymer of vinyl chloride, polyolefin, polycarbonate, polyester, polyamide, and acrylonitrile butadiene styrene copolymer (ABS). 5. The core layer of claim 1 wherein the at least one electronic component comprises at least one integrated circuit (IC) or a battery, wherein the at least one IC is partially or fully disposed inside the at least one cavity and over the thermoplastic layer. 6. The core layer of claim 1 wherein the base polymer resin in the crosslinked polymer composition is epoxy or urethane acrylate. 7. The core layer of claim 1 wherein the outer surface of the core layer has a portion over the at least one cavity, and the crosslinked polymer composition fully defines the portion of the outer surface over the at least one cavity. 8. The core layer of claim 1 wherein the at least one cavity has a size larger than that of the inlay layer, which is fully disposed inside the at least one cavity. 9. The core layer of claim 1 wherein at least one cavity has a size the same as or slightly larger than that of the inlay layer, and has a shape matching with that of the inlay layer. 10. The core layer of claim 1 , wherein the crosslinked polymer composition defines a respective portion of the upper surface of the core layer over the at least cavity. 11. The core layer of claim 1 , wherein the crosslinked polymer composition and the thermoplastic layer define the upper surface of the core layer. 12. A core layer for an information carrying card, comprising a thermoplastic layer defining at least one cavity therein; an inlay layer comprising at least one electronic component partially or fully disposed inside the at least one cavity; and a crosslinked polymer composition disposed in the at least one cavity and contacting the at least one electronic component, the crosslinked polymer composition comprising: a base polymer resin selected from the group consisting of urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy, wherein the crosslinked polymer composition at least partially defines an outer surface of the core layer, the inlay layer is fully embedded inside the crosslinked polymer composition, and the outer surface of the core layer is an upper surface of the core layer opposite to a bottom surface of the thermoplastic layer, wherein the at least one cavity has a size the same as or larger than that of the inlay layer. 13. The core layer of claim 12 wherein each cavity of the at least one cavity has a respective continuous surface profile solely defined by and inside the thermoplastic layer, the continuous surface profile having a respective bottom wall surface and a respective side wall surface. 14. The core layer of claim 12 wherein the inlay layer comprises a supporting film, and the at least one electronic component is embedded or mounted on the supporting film. 15. The core layer of claim 12 wherein the base polymer resin in the crosslinked polymer composition is epoxy or urethane acrylate, and the thermoplastic layer comprises polyvinyl chloride or copolymer of vinyl chloride. 16. An information carrying card comprising the core layer of claim 1 . 17. The information carrying card of claim 16 wherein the base polymer resin in the crosslinked polymer composition is epoxy or urethane acrylate. 18. The information carrying card of claim 16 further comprising at least one printable thermoplastic film laminated onto the thermoplastic layer and the crosslinked polymer composition, and at least one transparent film laminated onto the at least one printable thermoplastic film. 19. The core layer of claim 12 , wherein the crosslinked polymer composition defines a respective portion of the upper surface of the core layer over the at least cavity. 20. The core layer of claim 12 , wherein the crosslinked polymer composition and the thermoplastic layer define the upper surface of the core layer.

Assignees

Inventors

Classifications

  • Mounting details of integrated circuit chips · CPC title

  • consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

  • Polymeric coating · CPC title

  • the fillers creating voids or cavities, e.g. by stretching · CPC title

  • characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

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What does patent US10836894B2 cover?
The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected f…
Who is the assignee on this patent?
X Card Holdings Llc
What technology area does this patent fall under?
Primary CPC classification G06K19/07745. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 17 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).