Multispectral plasmonic thermal imaging device
US-2019137341-A1 · May 9, 2019 · US
Multispectral plasmonic thermal imaging device
US10830647B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10830647-B2 |
| Application number | US-201916380046-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 10, 2019 |
| Priority date | Nov 3, 2017 |
| Publication date | Nov 10, 2020 |
| Grant date | Nov 10, 2020 |
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Abstract
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A computer-eimplemented thermal imaging device having an optically-sensitive layer that includes a superpixel having at least one pixel. The at least one pixel includes a plasmonic absorber configured to obtain radiance measurements of electromagnetic radiation emitted from an object at a plurality of wavelengths. The device further includes a processor configured to determine an emissivity and temperature for the electromagnetic radiation received at the plasmonic material from the object using the radiance measurements and to form an image of the object from the determined emissivity and temperature.
First claim
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What is claimed is: 1. A thermal imaging device, comprising: an optically-sensitive layer including a superpixel having a plurality of pixels, the plurality of pixels including a plasmonic absorber comprising graphene nanoribbons to obtain radiance measurements of electromagnetic radiation emitted from an object at a plurality of wavelengths, the plasmonic absorber being disposed between a plurality of top contacts and a bottom contact layer, the plasmonic absorber in each of the plurality of pixels is respectively in direct contact with one top contact of the plurality of top contacts; and a processor configured to determine an emissivity and temperature for the electromagnetic radiation received at the plasmonic material from the object using the radiance measurements and to form an image of the object from the determined emissivity and temperature. 2. The thermal imaging device of claim 1 further comprising a sensor coupled to the plasmonic absorber for measuring a voltage across the plasmonic absorber generated in response to the electromagnetic radiation. 3. The thermal imaging device of claim 1 , wherein the plasmonic absorber in at least one pixel of the plurality of pixels is dynamically tunable to at least two resonance wavelengths via an applied voltage, wherein radiance measurements are obtained at the plasmonic absorber at each of the at least two resonance wavelengths. 4. The thermal imaging device of claim 1 , wherein the superpixel includes a first pixel configured to measure radiance at a first resonance wavelength and a second pixel configured to measure radiance at second resonance wavelength.
Assignees
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Classifications
- G01J5/023Primary
Particular leg structure or construction or shape; Nanotubes · CPC title
by correcting for emissivity · CPC title
Optical filters · CPC title
having separate detection of emissivity · CPC title
using selective, monochromatic or bandpass filtering · CPC title
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- What does patent US10830647B2 cover?
- A computer-eimplemented thermal imaging device having an optically-sensitive layer that includes a superpixel having at least one pixel. The at least one pixel includes a plasmonic absorber configured to obtain radiance measurements of electromagnetic radiation emitted from an object at a plurality of wavelengths. The device further includes a processor configured to determine an emissivity and…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification G01J5/023. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Nov 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).