Plating apparatus and plating method
US-RE45687-E · Sep 29, 2015 · US
Paddle for use of stirring plating solution and plating apparatus including paddle
US10829865B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10829865-B2 |
| Application number | US-201916254232-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2019 |
| Priority date | Mar 1, 2018 |
| Publication date | Nov 10, 2020 |
| Grant date | Nov 10, 2020 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank. The paddle is configured such that at least a part of the non-pattern area of the substrate is constantly blocked when the paddle is viewed from the anode while the paddle is stirring the plating solution.
First claim
Opening claim text (preview).
What is claimed is: 1. A plating apparatus for electroplating a substrate including a non-pattern area, the plating apparatus comprising: a plating tank for holding a plating solution; an anode configured to be connected to a positive electrode of a power supply; and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank, wherein the paddle is configured such that at least a part of the non-pattern area of the substrate is constantly blocked when the paddle is viewed from the anode while the paddle is stirring the plating solution, wherein the paddle includes an outer peripheral portion and a rib, the paddle being configured such that at least a part of the non-pattern area of the substrate is constantly blocked by the rib when the paddle is viewed from the anode while the paddle is stirring the plating solution, the rib is configured to be attachable to and removable from the outer peripheral portion. 2. The plating apparatus according to claim 1 , wherein a position where the rib is attached to the outer peripheral portion is adjustable. 3. The plating apparatus according to claim 1 , wherein the rib extends in a direction where the paddle moves when the paddle stirs the plating solution. 4. The plating apparatus according to claim 1 , wherein the rib is configured to project toward a side of the anode from the outer peripheral portion.
Assignees
Inventors
Classifications
- C25D21/10Primary
Agitating of electrolytes; Moving of racks · CPC title
Drives therefor, e.g. crank mechanisms · CPC title
Stirrers constructions · CPC title
Mixing semiconducting materials, e.g. during semiconductor or wafer manufacturing processes · CPC title
performing a rectilinear reciprocating movement · CPC title
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Frequently asked questions
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- What does patent US10829865B2 cover?
- According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank. The paddl…
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D21/10. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).