Sound-assisted crack propagation for semiconductor wafering

Patent metadata

Field	Value
Publication number	US-10828800-B2
Application number	US-201716083276-A
Country	US
Kind code	B2
Filing date	Mar 8, 2017
Priority date	Mar 8, 2016
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material.

First claim

What is claimed is:

1. A method of wafering a material using controlled crack propagation, the method comprising:
applying a first stress to the material such that the first stress is below a critical stress point of the material and is insufficient to initiate cracking of the material;
applying a controlled ultrasound wave to the material causing a total stress applied at a crack tip in the material to exceed the critical stress point; and
adjusting at least one parameter of the controlled ultrasound wave to maintain a substantially constant crack velocity, wherein the at least one parameter is selected from a group consisting of a frequency of the controlled ultrasound wave and an amplitude of the controlled ultrasound wave.

2. The method of claim 1 , further comprising adjusting the controlled ultrasound wave to maintain a stress intensity K that is slightly above a critical stress intensity K IC of the material.

3. The method of claim 1 , wherein applying a controlled ultrasound wave includes:
applying a first ultrasound wave at a first frequency, wherein the first ultrasound wave alone does not apply sufficient stress at the crack tip to propagate cracking of the material; and
applying a second ultrasound wave at a second frequency, wherein the second ultrasound wave alone does not apply sufficient stress at the crack tip to propagate cracking of the material,
wherein, when the first ultrasound wave and second ultrasound wave periodically align to be applied at the crack tip in phase, the resulting stress is sufficient to propagate cracking of the material.

4. The method of claim 1 , further comprising applying a dampening material to an exterior surface of the material in order to absorb acoustic waves generated by the cracking of the material.

5. The method of claim 1 , wherein applying a first stress includes applying a mechanical stress on the material in a direction perpendicular to the direction of the applied ultrasound wave.

6. The method of claim 5 , wherein applying the mechanical stress on the material includes applying a weight to the material.

7. The method of claim 5 , wherein applying the mechanical stress on the material includes pulling the material in a direction perpendicular to the direction of the applied ultrasound wave.

8. The method of claim 1 , wherein applying the first stress includes regulating a temperature of the material to cause thermal spalling in the material.

9. The method of claim 1 , wherein applying a first stress includes applying a high-frequency ultrasound wave.

Assignees

• Univ Arizona State

Inventors

• Bertoni Mariana
• Coll Pablo Guimera

Classifications

• H10P90/00

  Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• G01N29/045 Primary

  by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks (measuring resonant frequency G01H13/00; measuring strength properties by application of mechanical stress G01N3/00) · CPC title

• C03B33/033

  Apparatus for opening score lines in glass sheets · CPC title

• B26F3/002

  Precutting and tensioning or breaking · CPC title