Apparatus and methods for non-destructive inspection using microwave microscopy

Patent metadata

Field	Value
Publication number	US-10823757-B2
Application number	US-201816020261-A
Country	US
Kind code	B2
Filing date	Jun 27, 2018
Priority date	Jun 30, 2017
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

Methods and apparatus for non-destructive inspection using microwave microscopy are disclosed. In one embodiment, a method for inspecting an electrically-conductive mesh in a composite component using microwave microscopy comprises generating radio-frequency electromagnetic radiation using a microwave microscopy probe disposed adjacent the composite component so that the radio-frequency electromagnetic radiation interacts with the electrically-conductive mesh in the composite component, and, detecting a characteristic associated with the microwave microscopy probe. The detected characteristic is indicative of a condition of the electrically-conductive mesh.

First claim

What is claimed is:

1. A method for inspecting an electrically-conductive mesh in a composite component using microwave microscopy, the method comprising:
generating radio-frequency electromagnetic radiation using a microwave microscopy probe disposed adjacent the composite component so that the radio-frequency electromagnetic radiation interacts with the electrically-conductive mesh in the composite component; and
detecting a characteristic associated with the microwave microscopy probe when the radio-frequency electromagnetic radiation is interacting with the electrically-conductive mesh, the characteristic being indicative of a condition of the electrically-conductive mesh.

2. The method as defined in claim 1 , comprising:
sequentially causing the radio-frequency electromagnetic radiation to interact with different portions of the electrically-conductive mesh in the composite component, the different portions being associated with different relative positions of the microwave microscopy probe and the composite component, the different portions spanning over a plurality of regularly-spaced features of the electrically-conductive mesh;
detecting the characteristic associated with the microwave microscopy probe at each of the different relative positions of the composite component and the microwave microscopy probe, the detected characteristics defining a pattern related to the regularly-spaced features of the electrically-conductive mesh; and
detecting an irregularity in the pattern defined by the detected characteristics, the irregularity being indicative of damage to the portion of the electrically-conductive mesh corresponding to the irregularity.

3. The method as defined in claim 2 , wherein the regularly-spaced features comprise openings, each opening being outlined by an electrical conductor defining an electrically-conductive loop, the method comprising generating a magnetic field using the microwave microscopy probe, the magnetic field simultaneously interacting with a majority of one of the conductive loops.

4. The method as defined in claim 2 , wherein the regularly-spaced features comprise electrical conductors defining electrically-conductive loops, the method comprising generating a magnetic field using the microwave microscopy probe, the magnetic field simultaneously interacting with a majority of one of the conductive loops.

5. The method as defined in claim 3 , wherein the magnetic field simultaneously interacts with substantially the entire one of the conductive loops.

6. The method as defined in claim 2 , wherein the damage to the corresponding portion of the electrically-conductive mesh comprises an electrical discontinuity.

7. The method as defined in claim 2 , wherein the pattern defined by the detected characteristics exhibits a shift indicative of a change in depth of the electrically-conductive mesh from a surface of the composite component.

8. The method as defined in claim 2 , wherein the pattern defined by the detected characteristics exhibits a shift indicative of a change in thickness of a paint overlaying the electrically-conductive mesh.

9. The method as defined in claim 2 , comprising causing relative movement between the microwave microscopy probe and the composite component in a direction that is oblique to a row or column in which the regularly-spaced features lie.

10. The method as defined in claim 1 , comprising causing relative movement between the microwave microscopy probe and the composite component while the microwave microscopy probe is in contact with the composite component.

11. The method as defined in claim 1 , comprising causing relative movement between the microwave microscopy probe and the composite component while the microwave microscopy probe is resiliently biased against the composite component.

12. The method as defined in claim 1 , comprising generating a magnetic field using the microwave microscopy probe, the magnetic field interacting with the electrically-conductive mesh in the composite component.

13. The method as defined in claim 12 , wherein the electrically-conductive mesh comprises an electrical conductor defining an electrically-conductive loop, the magnetic field simultaneously interacting with a majority of the electrically-conductive loop.

14. The method as defined in claim 12 , wherein the electrically-conductive mesh comprises an electrical conductor defining an electrically-conductive loop, the magnetic field simultaneously interacting with substantially the entire conductive loop.

15. The method as defined in claim 13 , wherein the condition of the electrically-conductive mesh comprises an electrical discontinuity in the electrically-conductive loop.

16. The method as defined in claim 1 , comprising magnetically coupling the microwave microscopy probe to the electrically-conductive mesh.

17. The method as defined in claim 1 , wherein the characteristic associated with the microwave microscopy probe comprises a resonant frequency.

18. A method for inspecting a component using microwave microscopy, the method comprising:
causing relative sliding between a microwave microscopy probe and the component between different positions of the microwave microscopy probe relative to the component;
at each of the positions:
generating radio-frequency electromagnetic radiation for interacting with the component using the microwave microscopy probe; and
detecting a characteristic associated with the microwave microscopy probe when the radio-frequency electromagnetic radiation is interacting with the component, the characteristic being indicative of a condition of the component associated with the corresponding position; and

generating a magnetic field for interacting with an electrically-conductive mesh in the component using the microwave microscopy probe.

19. The method as defined in claim 18 , comprising resiliently biasing the microwave microscopy probe against the component while causing the relative sliding.

20. The method as defined in claim 18 , wherein the characteristic associated with the microwave microscopy probe comprises a resonant frequency.

21. An apparatus for inspecting an electrically-conductive mesh in a composite component, the electrically-conductive mesh comprising an electrical conductor defining an electrically-conductive loop, the apparatus comprising:
a radio-frequency source; and
a microwave microscopy probe operatively connected to the radio-frequency source and configured to generate radio-frequency electromagnetic radiation for interaction with the electrically-conductive mesh in the composite component, the microwave microscopy probe comprising a tip shaped to magnetically couple with a majority of the electrically-conductive loop defined by the electrical conductor of the electrically-conductive mesh.

22. The apparatus as defined in claim 21 , wherein the tip is shaped to magnetically couple with substantially the entire electrically-conductive loop defined by the electrical conductor.

23. The apparatus as defined in claim 21 , wherein the tip defines a two-dimensional shape that substantially matches a majority of a two-dimensional shape of the electrically-conductive loop defined by the electrical conductor.

24. The apparatus as defined in claim 21 , wherein the tip defines a two-dimensional shape that substantially matches an entirety of a two-dimensional shape of the electrically-conductive loop defined by the electrical conductor.

Assignees

• Bombardier Inc

Inventors

• Rufail Leandro
• Laurin Jean-Jacques
• Moupfouma Fidele

Classifications

• G01Q70/06

  Probe tip arrays · CPC title

• G01Q60/22 Primary

  Probes, their manufacture, or their related instrumentation, e.g. holders · CPC title