Systems, compositions, and methods for enhanced electromagnetic shielding and corrosion resistance
US-11965116-B2 · Apr 23, 2024 · US
US10818405B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10818405-B2 |
| Application number | US-201615743125-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 8, 2016 |
| Priority date | Jul 9, 2015 |
| Publication date | Oct 27, 2020 |
| Grant date | Oct 27, 2020 |
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A particle composition includes metal fine particles composed of a metal element having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles being coated with a coating material; a low melting point metal powder composed of a metal or alloy having a bulk melting point of 420° C. or less; and an activating agent that decomposes and removes the coating material from the surface of the metal fine particles after the low melting point metal powder is melted, wherein a content of the metal fine particles containing the coating material is 0.5 mass % to 50 mass %, and a ratio ([inorganic compound/metal fine particles]×100 (mass %)) of the inorganic compound in the metal fine particles is 0.1 mass % to 50 mass %.
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What is claimed is: 1. A metal fine particle-containing composition comprising, metal fine particles (P1) composed of a metal element (M) having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles (P1) being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles (P1) being coated with a coating material (C); a low melting point metal powder (P2) composed of a metal or an alloy having a bulk melting point of 420° C. or less; and an activating agent (A) that decomposes and removes the coating material (C) from the part of or the entire surface of the metal fine particles (P1) after the low melting point metal powder (P2) is melted, wherein the coating material (C) comprises an organic compound (C2), a content of the metal fine particles (P1) containing the coating material (C) is 0.5 mass % to 50 mass %, a ratio ([the organic compound (C2)/the metal fine particles (P1)]×100 (mass %)) of the organic compound (C2) in the metal fine particles (P1) is 0.1 mass % to 30 mass %, and the organic compound (C2) has a boiling point or decomposition point greater than or equal to the bulk melting point of the low melting point metal powder (P2). 2. The metal fine particle-containing composition according to claim 1 , wherein the metal element (M) is one, two or more selected from the group consisting of copper, silver, gold, and nickel. 3. The metal fine particle-containing composition according to claim 1 , wherein a particle diameter of primary particles of the low melting point metal powder (P2) is 0.5 μm to 50 μm. 4. The metal fine particle-containing composition according to claim 1 , wherein the low melting point metal powder (P2) is a tin or a tin alloy in which one, two, or more selected from the group consisting of copper, silver, zinc, phosphorus, aluminum, and bismuth are solid-solved with tin. 5. The metal fine particle-containing composition according to claim 1 , wherein the coating material (C) further comprises an inorganic compound (C1). 6. The metal fine particle-containing composition according to claim 5 , wherein the inorganic compound (C1) is one, two, or more selected from the group consisting of oxides, hydroxides, chlorides, carbonates, sulfates and sulfides of the metal element (M). 7. The metal fine particle-containing composition according to claim 5 , wherein a ratio ([the inorganic compound (C1)/the metal fine particles (P1)]×100 (mass %)) of the inorganic compound (C1) in the metal fine particles (P1) is 0.1 mass % to 50 mass %. 8. The metal fine particle-containing composition according to claim 1 , wherein the organic compound (C2) is one, two, or more selected from the group consisting of an organic phosphorus compound, an organic sulfur compound, polyvinylpyrrolidone, polyacrylamide, polyvinyl alcohol, 2-pyrrolidone, and alkyl-2-pyrrolidone. 9. The metal fine particle-containing composition according to claim 1 , wherein the activating agent (A) has one, two, or more carboxyl groups or ester groups. 10. The metal fine particle-containing composition according to claim 1 , wherein the activating agent (A) has one, two, or more ether bonds. 11. The metal fine particle-containing composition according to claim 1 , wherein a boiling point or decomposition point of the activating agent (A) is greater than or equal to a melting point of the low melting point metal powder (P2). 12. The metal fine particle-containing composition according to claim 1 , wherein at least a part or an entire surface of the low melting point metal powder (P2) is covered with the organic compound (C2). 13. The metal fine particle-containing composition according to claim 1 , further comprising an organic solvent (S) in which the activating agent (A) is soluble, wherein the organic solvent (S) includes alcohols (S1), and the alcohols (S1) include one, two, or more selected from the group consisting of methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, 2,2-dimethyl-1-propanol, 1-pentanol, 2-pentanol, 3-pentanol, 3-methyl-1-butanol, 2-methyl-1-butanol, 2,2-dimethyl-1-propanol, 3-methyl-2-butanol, 2-methyl-2-butanol, 1-hexanol, 2-hexanol, 3-hexanol, 2-methyl-2-hexanol, 2-methyl-3-hexanol, 1-heptanol, 2-heptanol, 4-heptanol, 2-ethyl-1-hexanol, 1-octanol, 2-octanol, ethylene glycol, diethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2-butene-1,4-diol, 2,3-butanediol, pentanediol, hexanediol, octanediol, glycerin, 1,1,1-trishydroxymethylethane, 2-ethyl-2-hydroxymethyl-1, 3-propanediol, 1,2,6-hexane triol, 1,2,3-hexanetriol, and 1,2,4-butanetriol. 14. The metal fine particle-containing composition according to claim 13 , wherein the organic solvent (S) further contains a glycol monoalkyl ethers (S2) having an ether bond at least at an end of the bond being an alkyl group. 15. The metal fine particle-containing composition according to claim 14 , wherein the organic solvent (S) has a boiling point at normal pressure of 100° C. or more and 500° C. or less. 16. The metal fine particle-containing composition according to claim 13 , wherein the organic solvent (S) has a boiling point at normal pressure of 100° C. or more and 500° C. or less. 17. The metal fine particle-containing composition according to claim 1 , further comprising a high melting point metal powder (P3) having a melting point of greater than 420° C. composed of the metal element (M) with a primary particle diameter of primary particles of the high melting point metal powder (P3) being greater than 500 nm and less than or equal to 50 μm.
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