Metal fine particle-containing composition

US10818405B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10818405-B2
Application numberUS-201615743125-A
CountryUS
Kind codeB2
Filing dateJul 8, 2016
Priority dateJul 9, 2015
Publication dateOct 27, 2020
Grant dateOct 27, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A particle composition includes metal fine particles composed of a metal element having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles being coated with a coating material; a low melting point metal powder composed of a metal or alloy having a bulk melting point of 420° C. or less; and an activating agent that decomposes and removes the coating material from the surface of the metal fine particles after the low melting point metal powder is melted, wherein a content of the metal fine particles containing the coating material is 0.5 mass % to 50 mass %, and a ratio ([inorganic compound/metal fine particles]×100 (mass %)) of the inorganic compound in the metal fine particles is 0.1 mass % to 50 mass %.

First claim

Opening claim text (preview).

What is claimed is: 1. A metal fine particle-containing composition comprising, metal fine particles (P1) composed of a metal element (M) having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles (P1) being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles (P1) being coated with a coating material (C); a low melting point metal powder (P2) composed of a metal or an alloy having a bulk melting point of 420° C. or less; and an activating agent (A) that decomposes and removes the coating material (C) from the part of or the entire surface of the metal fine particles (P1) after the low melting point metal powder (P2) is melted, wherein the coating material (C) comprises an organic compound (C2), a content of the metal fine particles (P1) containing the coating material (C) is 0.5 mass % to 50 mass %, a ratio ([the organic compound (C2)/the metal fine particles (P1)]×100 (mass %)) of the organic compound (C2) in the metal fine particles (P1) is 0.1 mass % to 30 mass %, and the organic compound (C2) has a boiling point or decomposition point greater than or equal to the bulk melting point of the low melting point metal powder (P2). 2. The metal fine particle-containing composition according to claim 1 , wherein the metal element (M) is one, two or more selected from the group consisting of copper, silver, gold, and nickel. 3. The metal fine particle-containing composition according to claim 1 , wherein a particle diameter of primary particles of the low melting point metal powder (P2) is 0.5 μm to 50 μm. 4. The metal fine particle-containing composition according to claim 1 , wherein the low melting point metal powder (P2) is a tin or a tin alloy in which one, two, or more selected from the group consisting of copper, silver, zinc, phosphorus, aluminum, and bismuth are solid-solved with tin. 5. The metal fine particle-containing composition according to claim 1 , wherein the coating material (C) further comprises an inorganic compound (C1). 6. The metal fine particle-containing composition according to claim 5 , wherein the inorganic compound (C1) is one, two, or more selected from the group consisting of oxides, hydroxides, chlorides, carbonates, sulfates and sulfides of the metal element (M). 7. The metal fine particle-containing composition according to claim 5 , wherein a ratio ([the inorganic compound (C1)/the metal fine particles (P1)]×100 (mass %)) of the inorganic compound (C1) in the metal fine particles (P1) is 0.1 mass % to 50 mass %. 8. The metal fine particle-containing composition according to claim 1 , wherein the organic compound (C2) is one, two, or more selected from the group consisting of an organic phosphorus compound, an organic sulfur compound, polyvinylpyrrolidone, polyacrylamide, polyvinyl alcohol, 2-pyrrolidone, and alkyl-2-pyrrolidone. 9. The metal fine particle-containing composition according to claim 1 , wherein the activating agent (A) has one, two, or more carboxyl groups or ester groups. 10. The metal fine particle-containing composition according to claim 1 , wherein the activating agent (A) has one, two, or more ether bonds. 11. The metal fine particle-containing composition according to claim 1 , wherein a boiling point or decomposition point of the activating agent (A) is greater than or equal to a melting point of the low melting point metal powder (P2). 12. The metal fine particle-containing composition according to claim 1 , wherein at least a part or an entire surface of the low melting point metal powder (P2) is covered with the organic compound (C2). 13. The metal fine particle-containing composition according to claim 1 , further comprising an organic solvent (S) in which the activating agent (A) is soluble, wherein the organic solvent (S) includes alcohols (S1), and the alcohols (S1) include one, two, or more selected from the group consisting of methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, 2,2-dimethyl-1-propanol, 1-pentanol, 2-pentanol, 3-pentanol, 3-methyl-1-butanol, 2-methyl-1-butanol, 2,2-dimethyl-1-propanol, 3-methyl-2-butanol, 2-methyl-2-butanol, 1-hexanol, 2-hexanol, 3-hexanol, 2-methyl-2-hexanol, 2-methyl-3-hexanol, 1-heptanol, 2-heptanol, 4-heptanol, 2-ethyl-1-hexanol, 1-octanol, 2-octanol, ethylene glycol, diethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2-butene-1,4-diol, 2,3-butanediol, pentanediol, hexanediol, octanediol, glycerin, 1,1,1-trishydroxymethylethane, 2-ethyl-2-hydroxymethyl-1, 3-propanediol, 1,2,6-hexane triol, 1,2,3-hexanetriol, and 1,2,4-butanetriol. 14. The metal fine particle-containing composition according to claim 13 , wherein the organic solvent (S) further contains a glycol monoalkyl ethers (S2) having an ether bond at least at an end of the bond being an alkyl group. 15. The metal fine particle-containing composition according to claim 14 , wherein the organic solvent (S) has a boiling point at normal pressure of 100° C. or more and 500° C. or less. 16. The metal fine particle-containing composition according to claim 13 , wherein the organic solvent (S) has a boiling point at normal pressure of 100° C. or more and 500° C. or less. 17. The metal fine particle-containing composition according to claim 1 , further comprising a high melting point metal powder (P3) having a melting point of greater than 420° C. composed of the metal element (M) with a primary particle diameter of primary particles of the high melting point metal powder (P3) being greater than 500 nm and less than or equal to 50 μm.

Assignees

Inventors

Classifications

  • Metallic particles coated with a non-metal (coated with lubricating or binding agents or with organic material B22F1/10) · CPC title

  • Metallic powder coated with organic material · CPC title

  • Nanosized particles · CPC title

  • characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

  • Pastes, creams or slurries · CPC title

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What does patent US10818405B2 cover?
A particle composition includes metal fine particles composed of a metal element having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles being coated with a coating material; a low melting point metal powder composed of a metal or alloy h…
Who is the assignee on this patent?
Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01B1/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 27 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).