Heat exchanger, heat exchange method using heat exchanger, heat transport system using heat exchanger, and heat transport method using heat transport system

Patent metadata

Field	Value
Publication number	US-10816283-B2
Application number	US-201815901057-A
Country	US
Kind code	B2
Filing date	Feb 21, 2018
Priority date	Feb 24, 2017
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

A heat exchanger is configured to perform heat exchange by boiling a liquid by heat transfer from a heat source to the liquid through a heat transfer member. In the heat exchanger, a first heat conduction region and a second heat conduction region are alternately provided in a form of stripes on a surface on a side that contacts the liquid such that the liquid boils via a heat transfer member.

First claim

What is claimed is:

1. A heat exchanger, comprising:
a heat transfer member interposed between a heat source and a liquid to permit heat exchange from the heat source to the liquid,
wherein the heat transfer member comprises a first heat conduction region having a first surface and a second heat conduction region having a second surface that are alternately provided in a form of stripes, and the first surface and the second surface are coplanar and form a planar surface of the heat transfer member that is configured to contact the liquid, and
a first thermal conductivity of the first heat conduction region is greater than a second thermal conductivity of the second heat conduction region.

2. The heat exchanger according to claim 1 , wherein a width of a stripe of the first heat conduction region, on the planar surface of the heat transfer member, is between 2.5 millimeters (mm) and 7.5 mm.

3. The heat exchanger according to claim 1 , wherein a width of a stripe of the second heat conduction region, on the planar surface of the heat transfer member, is between 0.1 millimeters (mm) and 1.0 mm.

4. The heat exchanger according to claim 1 , wherein a value of the second thermal conductivity, of a second heat conductive material, of the second heat conduction region is less than 0.02 times another value of the first thermal conductivity, of a first heat conductive material, of the first heat conduction region.

5. The heat exchanger according to claim 1 , wherein a softening temperature or a glass-transition temperature, of a second heat conductive material, of the second heat conduction region is equal to or greater than 120° C.

6. The heat exchanger according to claim 1 , wherein the heat transfer member is comprised of a first heat conductive material, and the second heat conduction region is comprised of a second heat conductive material and is embedded in the planar surface of the heat transfer member that is configured to contact the liquid.

7. The heat exchanger according to claim 1 , further comprising:
a liquid supply port to supply the liquid to the planar surface of the heat transfer member that is configured to contact the liquid;
a container to accommodate the liquid and permit the liquid to boil; and
a gas discharge port to discharge, from the container, a gas that is generated based on boiling of the liquid.

8. A method, comprising:
performing, by a heat transfer member that is interposed between a heat source and a liquid, heat exchange from the heat source to the liquid, wherein
the heat transfer member comprises a first heat conduction region having a first surface and a second heat conduction region having a second surface that are alternately provided in a form of stripes, and the first surface and the second surface and coplanar and form a planar surface of the heat transfer member that contacts the liquid, and
a first thermal conductivity of the first heat conduction region is greater than a second thermal conductivity of the second heat conduction region.

9. The method according to claim 8 , wherein a temperature of the first heat conduction region in a heat exchanger is greater than a boiling point of the liquid at a pressure inside the heat exchanger, and a temperature difference between the temperature of the first heat conduction region and the boiling point of the liquid is greater than or equal to 10° C.

10. The method according to claim 9 , wherein the temperature difference between the temperature of the first heat conduction region in the heat exchanger and the boiling point of the liquid at the pressure inside the heat exchanger is less than or equal to 50° C.

11. The method according to claim 8 , wherein the liquid is at least one of water or a fluorine-based solvent.

12. The method according to claim 8 , wherein the heat source is a gas.

13. A heat transport system, comprising:
a heat exchanger comprising a heat transfer member that is interposed between a heat source and a liquid to permit heat exchange from the heat source to the liquid,
wherein the heat transfer member comprises a first heat conduction region having a first surface and a second heat conduction region having a second surface that are alternately provided in a form of stripes, and the first surface and the second surface are coplanar and form a planar surface of the heat transfer member that contacts the liquid, and
wherein a first thermal conductivity of the first heat conduction region is greater than a second thermal conductivity of the second heat conduction region;
a liquid supply port to supply the liquid to the planar surface of the heat transfer member that contacts the liquid;
a container to accommodate the liquid and permit the liquid to boil;
a gas discharge port to discharge, from the container, a gas that is generated based on boiling of the liquid;
a condenser that comprises a gas condensing container, a gas supply port through which the gas is supplied to the gas condensing container, and a liquid discharge port through which the liquid, in which the gas is condensed, is discharged from the gas condensing container;
a liquid flow path that links the liquid discharge port of the condenser and the liquid supply port of the heat exchanger; and
a gas flow path that links the gas discharge port of the heat exchanger and the gas supply port of the condenser.

14. The heat transport system according to claim 13 , wherein a temperature of the first heat conduction region in the heat exchanger is configured to be greater than a boiling point of the liquid, at a pressure inside the heat exchanger, and a temperature difference between the temperature of the first heat conduction region and the boiling point of the liquid is configured to be greater than or equal to 10° C.

15. The heat transport system according to claim 14 , wherein the temperature difference between the temperature of the first heat conduction region in the heat exchanger and the boiling point of the liquid at the pressure inside the heat exchanger is configured to be less than or equal to 50° C.

16. The heat transport system according to claim 13 , wherein the liquid is at least one of water or a fluorine-based solvent.

17. The heat transport system according to claim 13 , wherein the heat source is a gas.

18. The heat exchanger according to claim 1 , further comprising:
a liquid supply port to supply the liquid to the planar surface of the heat transfer member that contacts the liquid;
a container to accommodate the liquid and permit the liquid to boil;
a gas discharge port to discharge, from the container, a gas that is generated based on boiling of the liquid;
a condenser that comprises a gas condensing container, a gas supply port through which the gas is supplied to the gas condensing container, and a liquid discharge port through which the liquid, in which the gas is condensed, is discharged from the gas condensing container;
a liquid flow path that links the liquid discharge port of the condenser and the liquid supply port of the heat exchanger; and
a gas flow path that links the gas discharge port of the heat exchanger and the gas supply port of the condenser.

Assignees

• Toyota Motor Co Ltd

Inventors

• Kusano Yuya
• Yamashita Seiji

Classifications

• F28F13/14

  by endowing the walls of conduits with zones of different degrees of conduction of heat · CPC title

• F28F3/048

  in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels · CPC title

• F28F3/00 Primary

  Plate-like or laminated elements; Assemblies of plate-like or laminated elements (specially adapted for movement F28F5/00) · CPC title

• F28F13/187

  especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites · CPC title

• F28D15/02 Primary

  in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} · CPC title