Heat sink structure with a vapor-permeable membrane for two-phase cooling

Patent metadata

Field	Value
Publication number	US-9102021-B2
Application number	US-201314064322-A
Country	US
Kind code	B2
Filing date	Oct 28, 2013
Priority date	Jul 25, 2011
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

First claim

What is claimed is:

1. An apparatus comprising:
a heat sink for cooling at least one electronic component with a coolant, without the coolant directly contacting the at least one electronic component, the heat sink comprising:
a thermally conductive structure comprising at least one coolant-carrying channel defined therein, the at least one coolant-carrying channel comprising a first channel end and a second channel end;
a coolant inlet port;
a membrane structure associated w…

Assignees

• IBM

Inventors

• Campbell Levi A
• Chu Richard C
• David Milnes P
• Ellsworth Jr Michael J
• Iyengar Madhusudan K
• Simons Robert E

Classifications

• H05K7/20772

  Electricity · mapped topic

• Y10T29/4935

  Cross-Sectional Technologies · mapped topic

• H05K7/20272 Primary

  Electricity · mapped topic

• F28F3/00

  Mechanical Engineering · mapped topic

• G06F1/20

  Physics · mapped topic