Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

Patent metadata

Field	Value
Publication number	US-10815397-B2
Application number	US-201715475604-A
Country	US
Kind code	B2
Filing date	Mar 31, 2017
Priority date	Sep 27, 2012
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

First claim

The invention claimed is:

1. An adhesive to decrease the basis weight of a substrate comprising:
(a) an emulsion-based polymer selected from the group consisting of polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, and mixtures thereof; and
(b) a plurality of microspheres, wherein the microspheres have a volume of about 10 to about 50V/V % in the adhesive.

2. The adhesive of claim 1 , wherein the microspheres are radiation and/or heat expandable polymeric microspheres having an expansion temperature (T exp ) of about 80° C. to about 135° C. and a maximum expansion temperature (T max ) of about 120° C. to about 200° C.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Huang Tianjian
• Thompson Kristina
• Waski Daniel
• Meccia John

Classifications

• B32B7/12 Primary

  using interposed adhesives or interposed materials with bonding properties · CPC title

• D21H17/37

  Polymers of unsaturated acids or derivatives thereof, e.g. polyacrylates · CPC title

• C09J5/06

  involving heating of the applied adhesive · CPC title

• B32B27/10

  of paper or cardboard · CPC title

• B32B2255/10

  on synthetic resin layer or on natural or synthetic rubber layer · CPC title