Soldering apparatus and method for manufacturing electronic unit

Patent metadata

Field	Value
Publication number	US-10814418-B2
Application number	US-201715795333-A
Country	US
Kind code	B2
Filing date	Oct 27, 2017
Priority date	Nov 8, 2016
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

First claim

What is claimed is:

1. A soldering apparatus comprising:
a soldering iron having a soldering tip for carrying out a soldering process to a processing object;
a heater configured to heat the soldering iron at least when the soldering process is carried out; and
a gas supply device connected to the soldering iron, the gas supply device being configured to operatively supply a burning-assist gas to the soldering iron when a cleaning process is carried out for the soldering iron.

2. The soldering apparatus according to claim 1 , wherein
the gas supply device comprises:
a gas separator configured to separate air into nitrogen gas having a nitrogen density higher than that of the air and oxygen-rich gas having an oxygen density higher than that of the air, wherein the oxygen-rich gas is used as the burning-assist gas; and
a gas switching valve configured to switch gas to be supplied to the soldering iron from the nitrogen gas to the oxygen-rich gas, or vice versa.

3. The soldering apparatus according to claim 1 , wherein
the soldering iron is formed in a cylindrical shape in such a way that a solder supply passage extends in an axial direction of the soldering iron from a backward-end side of the soldering iron to the soldering tip, and
the burning-assist gas passes through the solder supply passage from the backward-end side to the soldering tip when the cleaning process is carried out.

4. The soldering apparatus according to claim 1 , further comprising:
a forward-end cover for covering the soldering tip when the burning-assist gas is supplied to the soldering iron, in such a way that a gap is formed between the soldering tip and the forward-end cover.

5. The soldering apparatus according to claim 4 , wherein
the forward-end cover has heat conductivity lower than that of the soldering iron.

6. The soldering apparatus according to claim 1 , further comprising:
a soldering process control portion for controlling the soldering process to the processing object; and
a cleaning process control portion for carrying out the cleaning process to the soldering iron when the soldering process to the processing object is stopped,
wherein the cleaning process control portion controls the heater in order to heat the soldering iron and further controls the gas supply device in order to supply the burning-assist gas to the soldering iron.

7. A cleaning unit for cleaning a soldering apparatus, comprising:
a soldering iron having a soldering tip for carrying out a soldering process to a processing object; and
a heater configured to heat the soldering iron,
a gas supply device connected to the soldering iron, the gas supply device being configured to operatively supply a burning-assist gas to the soldering iron, and
wherein the gas supply device comprises:
a gas separator configured to separate air into nitrogen gas having a nitrogen density higher than that of the air and oxygen-rich gas having an oxygen density higher than that of the air, wherein the oxygen-rich gas is used as the burning-assist gas; and
a gas switching valve configured to switch gas to be supplied to the soldering iron from the nitrogen gas to the oxygen-rich gas, or vice versa.

8. A manufacturing method for an electronic control unit comprising:
providing a soldering apparatus to mount an electronic component to a printed circuit board of an, wherein the soldering apparatus comprises:
a soldering iron having a soldering tip for carrying out a soldering process to the printed circuit board,
a heater unit for heating configured to heat the soldering iron unit, and
a gas supply device for operatively supplying a burning-assist gas to the soldering iron during a cleaning process for the soldering iron;
soldering the printed circuit board, in which solder is supplied to the soldering iron and the soldering is carried out by the soldering tip, which is heated by the heater; and
cleaning the soldering iron after the soldering of the printed circuit board is stopped, in which the soldering iron is heated by the heater and the burning-assist gas is supplied from the gas supply device to the soldering iron in order to clean the soldering iron.

Assignees

• Denso Corp

Inventors

• Shiraishi Shinichiro
• Sugiura Mitsuhiro
• Ozawa Chisato

Classifications

• H05K3/3468 Primary

  Application of molten solder, e.g. dip soldering · CPC title

• B23K3/028

  Devices for cleaning soldering iron tips (B23K3/027 takes precedence) · CPC title

• B23K3/0638

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• H05K2203/081

  Blowing of gas, e.g. for cooling or for providing heat during solder reflowing · CPC title

• H05K3/3447

  Lead-in-hole components · CPC title