Low density microspheres

US10808094B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10808094-B2
Application numberUS-201515525656-A
CountryUS
Kind codeB2
Filing dateNov 11, 2015
Priority dateNov 11, 2014
Publication dateOct 20, 2020
Grant dateOct 20, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A composition of matter comprising a foam, said foam comprising polymeric microspheres, said polymeric microspheres further being expanded and further being fused to each other in at least one portion thereof, wherein said foam is characterized by a density below 15 kg/m 3 , and wherein said density is characterized as being a uniform density, said uniform density being characterized as having at least 90% of said foam with densities that vary within a range of less than 15%, said microspheres are limited to size variation of less than 15%, said microspheres are coated with multiwall carbon nanotubes at said carbon nanotubes density of 1.5 gr/cc to 2.5 gr/cc. 2. The composition of matter of claim 1 , wherein said polymeric microspheres are selected from the group consisting of: polyvinylchloride, polyacrylonitrile, polyvinylidene chloride, polyimide, and any combination and/or derivative, and/or copolymer thereof. 3. The composition-of-matter of claim 1 , wherein at least 85% of said microspheres are further limited to length or diameter variation of 160 to 240 micrometers. 4. The composition-of-matter of claim 1 , further comprising reinforcing fiber filaments, said reinforcing fiber filaments being aramid fiber filaments. 5. The composition-of-matter of claim 1 , wherein said polymeric microspheres further comprise a conductive additive, said conductive additive comprising a material selected from the group consisting of: carbon, a conductive polymer, conductive metal particle, a magnetic metal particle, metal alloys, ceramics, a composite material and any mixture thereof, and wherein said material is characterized as having a size of at least one dimension thereof that ranges from about 1 nm to 1000 nm. 6. The composition-of-matter of claim 5 , wherein said carbon is in the form selected from the group consisting of: pristine carbon nanotubes, functionalized carbon nanotubes, single walled carbon nanotubes, graphene, fullerene, carbon black, graphite, a carbon fiber, and any combination thereof. 7. A sandwich panel comprising: (a) a first skin and a second skin; and (b) the composition of matter of claim 1 wherein said composition of matter is a core being located between a first skin and a second skin. 8. The sandwich panel of claim 7 , said first skin and said second skin are stitched to a core using yarn beams wherein said yarn is selected from the group consisting of: carbon, glass, aramid, PBI, PABI, PBO, polyimide, polyamide, Poly(ethylene terephthalate) (PET), and any combination thereof. 9. The sandwich panel of claim 7 , further comprising second foam wherein said second foam: (a) comprises polymeric microspheres, said polymeric microspheres further being expanded and further being fused to each other in at least one portion thereof, (b) is characterized by a density below 15 kg/m 3 , wherein said density is characterized as being a uniform density, said uniform density being characterized as having at least 90% of said foam with densities that vary within a range of less than 15%, and wherein (c) said second foam filling a space surrounding said yarn beams. 10. The sandwich panel of claim 9 , wherein said second foam is characterized as having a density of at least 30% higher than the density of the foam being located between said first and second skin. 11. The sandwich panel of claim 7 , wherein said first skin, said second skin, or both further comprise a fibrous material and/or a resin. 12. The sandwich panel of claim 11 , wherein said resin is selected from the group consisting of: phenolic, epoxy, polyetheretherketone (PEEK), polyimides, polyamides, bismaleimides, polyphenylene sulfide (PPS), polyphenylene oxide (PPO), polysulphone (PSU) and Polybutylene terephthalate (PBT). 13. The sandwich panel of claim 11 , wherein said fibrous material is selected from the group consisting of: carbon, glass, aramid, polybenzimidazole (PBI), polyimide, polyamide, PET, and any combination thereof. 14. The sandwich panel of claim 7 , wherein said first skin and/or said second skin are coated with a material selected from the group consisting of: a metal, a composite, a ceramic, a polymer, and any combination thereof. 15. The sandwich panel of claim 7 , wherein said foam is selected from the group consisting of: PVC foam, polyurethane (PU) foam, styrene acrylonitrile (SAN) foam, polyethylene, polyimide foam, phenolic foam, and polymethacrylimide (Rohacell) foam.

Assignees

Inventors

Classifications

  • by stitching, needling or sewing (by {mechanically connecting} fibrous layers {to another layer} B32B5/06) · CPC title

  • Expandable microspheres, e.g. Expancel® · CPC title

  • C08J9/32Primary

    from compositions containing microballoons, e.g. syntactic foams · CPC title

  • by surface fusion and bonding of particles to form voids, e.g. sintering (of expandable particles C08J9/232) · CPC title

  • Density · CPC title

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Frequently asked questions

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What does patent US10808094B2 cover?
Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.
Who is the assignee on this patent?
Technion Res & Dev Foundation, Technion Res & Development Foundation
What technology area does this patent fall under?
Primary CPC classification C08J9/32. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 20 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).