Circuit assembly, electrical junction box, and manufacturing method for circuit assembly
US-10194523-B2 · Jan 29, 2019 · US
Power distribution board including a bus bar with recess affixed to heat dissipation member
US10806058B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10806058-B2 |
| Application number | US-201716300105-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 10, 2017 |
| Priority date | May 12, 2016 |
| Publication date | Oct 13, 2020 |
| Grant date | Oct 13, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
Provided is a power distribution board including: a bus bar; and a heat dissipation member that is disposed on one side of the bus bar via an adhesive layer, wherein the bus bar includes a recess that is open to the adhesive layer side, and that is filled with a constituent material of the adhesive layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A power distribution board comprising: a bus bar; and a heat dissipation member that is disposed on one side of the bus bar via an adhesive layer, wherein the bus bar includes a recess that is open to the adhesive layer side, and that is filled with a constituent material of the adhesive layer, wherein the adhesive layer forms a bead extending beyond a top surface of the bus bar wherein the recess is provided at a position where a force resulting from rotation of a nut relative to the bolt acts. 2. The power distribution board according to claim 1 , wherein the recess is a notch that extends from a bonding surface to an opposite surface, and that reaches to a side surface of the bus bar. 3. The power distribution board according to claim 2 , wherein the bus bar includes a main portion that is bonded to the adhesive layer, and an extending portion that is molded in one piece with the main portion and that extends from the main portion, and the extending portion includes, on a distal end side thereof, a bolt hole through which a bolt can pass, and includes the recess on the main portion side. 4. The power distribution board according to claim 1 , wherein the bus bar includes a main portion that is bonded to the adhesive layer, and an extending portion that is molded in one piece with the main portion and that extends from the main portion, and the extending portion includes, on a distal end side thereof, a bolt hole through which a bolt can pass, and includes the recess on the main portion side. 5. The power distribution board according to claim 1 , wherein a portion of the bead bounds a peripheral edge of the upper surface of the bus bar opposite the adhesive layer side. 6. A power distribution board comprising: a bus bar; and a heat dissipation member that is disposed on one side of the bus bar via an adhesive layer, wherein the bus bar includes a recess that is open to the adhesive layer side, and that is filled with a constituent material of the adhesive layer, wherein the recess is a bottomed depression that has an opening in the bonding surface.
Assignees
Inventors
Classifications
Package configurations · CPC title
Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title
High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence) · CPC title
- H02G5/10Primary
Cooling · CPC title
Laminated bus-bars · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10806058B2 cover?
- Provided is a power distribution board including: a bus bar; and a heat dissipation member that is disposed on one side of the bus bar via an adhesive layer, wherein the bus bar includes a recess that is open to the adhesive layer side, and that is filled with a constituent material of the adhesive layer.
- Who is the assignee on this patent?
- Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
- What technology area does this patent fall under?
- Primary CPC classification H02G5/10. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 13 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).