Circuit assembly and electrical junction box

US2017047720A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017047720-A1
Application numberUS-201515307703-A
CountryUS
Kind codeA1
Filing dateApr 21, 2015
Priority dateMay 9, 2014
Publication dateFeb 16, 2017
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is a circuit assembly that includes: a circuit board that has a connection opening; a plurality of busbars that are laid on one surface side of the circuit board; a coil that includes a main portion and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars exposed through the connection opening; and a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that face away from the circuit board. The circuit board is provided with a substrate through-hole in the vicinity of the connection opening, and the plurality of busbars are provided with a busbar through-hole at the position that corresponds to the substrate through-hole.

First claim

Opening claim text (preview).

1 . A circuit assembly comprising: a circuit board that has a connection opening; a plurality of busbars that are laid on one surface side of the circuit board; an electronic component that has a main portion and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars that are exposed through the connection opening; and a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that face away from the circuit board, wherein the circuit board is provided with a substrate through-hole in a vicinity of the connection opening, and the plurality of busbars are provided with a busbar through-hole at a position that corresponds to the substrate through-hole. 2 . The circuit assembly according to claim 1 , wherein the plurality of busbars are laid on the circuit board via an adhesive sheet, and the adhesive sheet is provided with a sheet through-hole at a position that corresponds to the substrate through-hole. 3 . An electrical junction box in which the circuit assembly according to claim 1 is accommodated in a case. 4 . An electrical junction box in which the circuit assembly according to claim 2 is accommodated in a case.

Assignees

Inventors

Classifications

  • Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

  • Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors · CPC title

  • Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

  • H02G3/16Primary

    structurally associated with support for line-connecting terminals within the box · CPC title

  • associated with surface mounted components · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2017047720A1 cover?
Provided is a circuit assembly that includes: a circuit board that has a connection opening; a plurality of busbars that are laid on one surface side of the circuit board; a coil that includes a main portion and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars exposed through the connection opening; and a heatsink that is laid, via an adhesive agent,…
Who is the assignee on this patent?
Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
What technology area does this patent fall under?
Primary CPC classification H02G3/16. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Feb 16 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).