Circuit materials with improved fire retardant system and articles formed therefrom
US-2015351237-A1 · Dec 3, 2015 · US
Circuit module
US10797003B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10797003-B2 |
| Application number | US-201916284457-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 25, 2019 |
| Priority date | Feb 27, 2018 |
| Publication date | Oct 6, 2020 |
| Grant date | Oct 6, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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Abstract
Official abstract text for this publication.
A circuit module 2 comprises: a wiring structure 4; an electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which the electronic component 6a, 6b is embedded; and a metal layer 10 provided on a side surface S1 of the insulating resin layer 8 and a side surface S2 of the wiring structure 4. The surface roughness of the side surface S1 of the insulating resin layer 8 is expressed as R1. The surface roughness of the side surface S2 of the wiring structure 4 is expressed as R2. R1 and R2 differ from each other.
First claim
Opening claim text (preview).
What is claimed is: 1. A circuit module comprising: a wiring structure; an electronic component arranged on an upper surface of the wiring structure; an insulating resin layer which is provided on the upper surface of the wiring structure and in which the electronic component is embedded; and a metal layer provided on a side surface of the insulating resin layer and a side surface of the wiring structure, wherein when the surface roughness of the side surface of the insulating resin layer is expressed as R 1 , and the surface roughness of the side surface of the wiring structure is expressed as R 2 , R 1 and R 2 differ from each other. 2. The circuit module according to claim 1 , wherein R 1 and R 2 satisfy the condition: R 2 >R 1 . 3. The circuit module according to claim 1 , wherein R 1 and R 2 satisfy the condition: R 1 >R 2 . 4. The circuit module according to claim 2 , wherein R 1 /R 2 ranges from 0.2 to 0.95. 5. The circuit module according to claim 3 , wherein R 1 /R 2 ranges from 1.05 to 10.5.
Assignees
Inventors
Classifications
shielding resins · CPC title
materials for magnetic shielding, e.g. ferromagnetic materials · CPC title
the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title
characterised by their shape or disposition · CPC title
batch processes · CPC title
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Frequently asked questions
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- What does patent US10797003B2 cover?
- A circuit module 2 comprises: a wiring structure 4; an electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which the electronic component 6a, 6b is embedded; and a metal layer 10 provided on a side surface S1 of the insulating resin layer 8 and a side surface S2 o…
- Who is the assignee on this patent?
- Tdk Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 06 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).