Laser processing method and laser processing apparatus

Patent metadata

Field	Value
Publication number	US-10796959-B2
Application number	US-201715808211-A
Country	US
Kind code	B2
Filing date	Nov 9, 2017
Priority date	Sep 13, 2000
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

First claim

What is claimed is:

1. A method of manufacturing a semiconductor device, the method comprising:
irradiating a substrate with a pulsed laser light at a converging point within the substrate, so that the converging point of the pulsed laser light is positioned within the substrate to form a modified spot within the substrate at the converging point, the pulsed laser light having a wavelength at which an internal transmittance of the laser light within the substrate is at least 80%; and
performing the irradiating step at multiple locations along each of a plurality of intersecting cutting lines along which the substrate is to be cut to form a plurality of modified spots within the substrate at converging points of the pulsed laser light, respectively, without melting a pulsed laser light incident surface of the substrate, the modified spots each including a modified region, the modified spots being formed intermittently along each of the plurality of intersecting cutting lines, the modified spots being formed in the substrate only by the laser irradiation converging within the substrate; and
cutting the substrate into parts by dry processing along the plurality of intersecting cutting lines by growing cracks from the modified spots which grow towards a front and a back surface of the substrate, without causing modifications to be formed in the front and back surfaces of the substrate other than the cracks cutting the substrate into parts, in order to provide at least one manufactured semiconductor device.

2. The method according to claim 1 , wherein the substrate is a silicon substrate.

3. The method according to claim 1 , wherein the pulsed laser light has a wavelength of at least 1100 nm.

4. The method according to claim 1 , wherein the pulsed laser light has a wavelength in the range of 1100 nm to 1340 nm.

5. The method according to claim 1 , wherein the pulsed laser light has a wavelength at which an internal transmittance of the laser light within the substrate is at least 90%.

6. The method according to claim 1 , wherein a thickness of the substrate is less than or equal to 1000 μm.

7. The method according to claim 1 , wherein a thickness of the substrate is less than or equal to 500 μm.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Fukuyo Fumitsugu
• Fukumitsu Kenshi
• Uchiyama Naoki
• Wakuda Toshimitsu

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title

• B23K20/26

  Auxiliary equipment · CPC title