Low temperature sintering porous metal foam layers for enhanced cooling and processes for forming thereof

Patent metadata

Field	Value
Publication number	US-10794642-B2
Application number	US-201715700749-A
Country	US
Kind code	B2
Filing date	Sep 11, 2017
Priority date	Sep 11, 2017
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A heat transfer surface with a convective cooling layer includes a metal substrate and a porous metal foam layer transient liquid phase (TLP) bonded on the metal substrate. The porous metal foam layer includes a plurality of high melting temperature (HMT) particles and a plurality of micro-channels. A first TLP intermetallic layer is positioned between, and TLP bonds together, adjacent HMT particles to form the porous metal foam layer. A second TLP intermetallic layer is positioned between and TLP bonds a subset of the plurality of HMT particles to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate. The plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate such that a cooling fluid may be wicked through the plurality of micro-channels to the surface of the metal substrate.

First claim

What is claimed is:

1. A heat transfer surface with a convective cooling layer comprising:
a metal substrate; and
a porous metal foam layer comprising:
a plurality of first high melting temperature (HMT) particles coated with a plurality of second HMT particles, and a plurality of micro-channels, wherein:
the plurality of first HMT particles comprise a first HMT material and have an average particle diameter of from 6 μm to 40 μm; and
the plurality of second HMT particles comprise a second HMT material and have an average particle diameter of from 1 μm to 5 μm;

a first TLP intermetallic bond positioned between and TLP bonding together adjacent first HMT particles, second HMT particles, or both, to form the porous metal foam layer; and

a second TLP intermetallic bond positioned between a subset of the plurality of first HMT particles, a subset of the plurality of second HMT particles, or both, to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate by the second TLP intermetallic bond;
wherein the plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate for a cooling fluid to be wicked through the plurality of micro-channels to the surface of the metal substrate.

2. The heat transfer surface of claim 1 , wherein the second HMT material is different than the first HMT material.

3. The heat transfer surface of claim 1 , further comprising a third TLP intermetallic bond positioned between and TLP bonding the plurality of second HMT particles to the plurality of first HMT particles.

4. The heat transfer surface of claim 1 , wherein the first TLP intermetallic bond is positioned between and bonds together a second HMT particle TLP bonded to a first HMT particle and an adjacent second HMT particle TLP bonded to another first HMT particle such that the first HMT particle and the another first HMT particle are TLP bonded together via the second HMT particle being TLP bonded to the adjacent second HMT particle.

5. The heat transfer surface of claim 1 , wherein:
a subset of the plurality of second HMT particles are positioned between the metal substrate and a subset of the plurality of first HMT particles;
the first TLP intermetallic bond is positioned between and TLP bonds the subset of the plurality of first HMT particles to the subset of the plurality of second HMT particles; and
the second TLP intermetallic bond is positioned between and TLP bonds the subset of the plurality of second HMT particles to the metal substrate such that the subset of the plurality of first HMT particles are TLP bonded to the metal substrate.

6. The heat transfer surface of claim 1 , wherein the plurality of first HMT particles are formed from copper, nickel, silver, aluminum or alloys thereof, and the plurality of second HMT particles are formed from nickel, silver or alloys thereof.

7. The heat transfer surface of claim 1 , wherein the metal substrate comprises a plurality of micro-boiling nucleation sites between the subset of the first HMT particles, the subset of second HMT particles, or both, TLP bonded to the metal substrate.

8. The heat transfer surface of claim 1 , wherein the first TLP intermetallic bond and the second TLP intermetallic bond comprise an intermetallic of tin.

9. The heat transfer surface of claim 1 , wherein the porous metal foam layer has a concentration of tin between 20 wt % and 40 wt %.

10. The heat transfer surface of claim 9 , wherein the concentration of tin is between 25 wt % and 35 wt %.

11. The heat transfer surface of claim 1 , wherein:
at least one of the first HMT particles, the second HMT particles, or both, includes copper or aluminum;
at least one of the first HMT particles, the second HMT particles, or both, includes nickel or silver; and
wherein the first TLP intermetallic bond, the second TLP intermetallic bond, or both comprise a ternary intermetallic compound comprising tin, at least one of copper or aluminum, and at least one of nickel or silver.

12. The heat transfer surface of claim 1 , wherein the plurality of first HMT particles are formed from a metal selected from the group consisting of copper, nickel, silver, aluminum, or combinations of these, and the plurality of second HMT particles are formed from a metal selected from the group consisting of nickel, silver, or nickel and silver.

13. The heat transfer surface of claim 1 , wherein the first TLP intermetallic bond, the second TLP intermetallic bond, or both, comprise an alloy of an LMT material and at least one metal from the first HMT particles, the second HMT particles, or both.

14. A heat exchanger with a heat transfer surface, the heat exchanger comprising:
a cold plate comprising a metal substrate through which heat flows from a heat source to the cold plate;
a porous metal foam layer comprising:
a plurality of first high melting temperature (HMT) particles coated with a plurality of second HMT particles and a plurality of micro-channels, wherein:
the plurality of first HMT particles comprise a first HMT material and have an average particle diameter of from 6 μm to 40 μm; and
the plurality of second HMT particles comprise a second HMT material and have an average particle diameter of from 1 μm to 5 μm;

a first TLP intermetallic bond positioned between and TLP bonding together adjacent first HMT particles, second HMT particles, or both, to form the porous metal foam layer; and

a second TLP intermetallic bond positioned between and TLP bonding a subset of the plurality of first HMT particles, a subset of the plurality of second HMT particles, or both, to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate;
wherein the plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate such that a cooling fluid is wicked through the plurality of micro-channels to the surface of the metal substrate.

15. The heat exchanger of claim 14 , wherein:
the second HMT material is different than the first HMT material; and wherein the heat exchanger further comprises
a third TLP intermetallic bond is positioned between and TLP bonds the plurality of second HMT particles to the plurality of first HMT particles.

Assignees

• Toyota Eng & Mfg North America

Inventors

• Joshi Shailesh N
• Liu Yanghe

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• B22F7/004 Primary

  comprising at least one non-porous part · CPC title