Heat pipe, heat dissipating component, and method for manufacturing heat pipe

US2018128554A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018128554-A1
Application numberUS-201815864369-A
CountryUS
Kind codeA1
Filing dateJan 8, 2018
Priority dateSep 28, 2015
Publication dateMay 10, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat pipe that includes a pipe casing, a porous wick, and sealing members. Both end portions of the pipe casing are sealed by the sealing members, respectively. The sealing members each comprise a first metal foil and an intermetallic compound phase. The inside of the pipe casing is filled with a working fluid. The porous wick generates capillarity for the working fluid by a plurality of pores. The porous wick is provided inside the pipe casing. As a result, the pipe casing and the porous wick form a cavity extending in a longitudinal direction of the pipe casing. The porous wick comprises first metal grains, second metal grains, and an intermetallic compound phase.

First claim

Opening claim text (preview).

1 . A heat pipe comprising: a pipe casing filled with a working fluid; and a porous wick inside the pipe casing, wherein the porous wick includes an intermetallic compound formed from at least a first metal and a second metal having a melting point higher than a melting point of the first metal. 2 . The heat pipe according to claim 1 , wherein the porous wick comprises a material containing the first metal, the second metal, and the intermetallic compound. 3 . The heat pipe according to claim 1 , wherein the porous wick has a porosity of 20% or more. 4 . The heat pipe according to claim 1 , wherein the first metal is at least one kind of metal selected from Sn and a Sn-based alloy; and the second metal is at least one kind of alloy selected from a CuNi alloy, a CuMn alloy, a CuAl alloy, and a CuCr alloy. 5 . A heat dissipating component comprising the heat pipe according to claim 1 . 6 . A heat pipe comprising: a pipe casing filled with a working fluid; a wick provided inside the pipe casing; and a sealing member that seals the pipe casing; wherein the sealing member includes an intermetallic compound formed from at least a first metal and a second metal having a melting point higher than a melting point of the first metal. 7 . The heat pipe according to claim 6 , wherein the sealing member seals an end portion of the pipe casing. 8 . The heat pipe according to claim 6 , wherein the sealing member comprises a material containing the first metal and the intermetallic compound. 9 . The heat pipe according to claim 6 , wherein the first metal is at least one kind of metal selected from Sn and a Sn-based alloy; and the second metal is at least one kind of alloy selected from a CuNi alloy, a CuMn alloy, a CuAl alloy, and a CuCr alloy. 10 . A heat dissipating component comprising the heat pipe according to claim 6 . 11 . A method for manufacturing a heat pipe, the method comprising: providing a metal composition inside a pipe casing, the metal composition containing a first metal and a second metal having a melting point higher than a melting point of the first metal; and heating the metal compound and causing the first metal and the second metal to react with each other to form a porous wick comprising a material containing an intermetallic compound inside the pipe casing. 12 . The method for manufacturing a heat pipe according to claim 11 , wherein the metal composition is in a paste state, and the metal composition is applied to the inside of the pipe casing while in the paste state. 13 . The method for manufacturing a heat pipe according to claim 11 , wherein the metal composition contains a flux. 14 . The method for manufacturing a heat pipe according to claim 11 , wherein, in the heating, the metal composition is heated to a temperature within a range of equal to or higher than the melting point of the first metal and equal to or lower than the melting point of the second metal. 15 . A method for manufacturing a heat pipe, the method comprising: providing a metal composition in an end portion of a pipe casing, the metal composition containing a first metal and a second metal having a melting point higher than a melting point of the first metal; and heating the metal compound and causing the first metal and the second metal to react with each other to form a sealing material containing an intermetallic compound inside the pipe casing. 16 . The method for manufacturing a heat pipe according to claim 15 , wherein the metal composition contains a flux. 17 . The method for manufacturing a heat pipe according to claim 15 , wherein in the heating, the metal composition is heated to a temperature within a range of equal to or higher than the melting point of the first metal and equal to or lower than the melting point of the second metal.

Assignees

Inventors

Classifications

  • Preventing the formation of deposits or corrosion, e.g. by using filters {or scrapers} · CPC title

  • Means for filling or sealing heat pipes · CPC title

  • Heat exchange elements made from metals or metal alloys · CPC title

  • for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title

  • from copper or copper alloys · CPC title

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What does patent US2018128554A1 cover?
A heat pipe that includes a pipe casing, a porous wick, and sealing members. Both end portions of the pipe casing are sealed by the sealing members, respectively. The sealing members each comprise a first metal foil and an intermetallic compound phase. The inside of the pipe casing is filled with a working fluid. The porous wick generates capillarity for the working fluid by a plurality of pore…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification F28D15/046. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu May 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).