Dual-cure resins and related methods

Patent metadata

Field	Value
Publication number	US-10793745-B2
Application number	US-201916377003-A
Country	US
Kind code	B2
Filing date	Apr 5, 2019
Priority date	May 1, 2017
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

First claim

What is claimed is:

1. A dual-cure resin for use in additive manufacturing, comprising:
a photo-curable component configured to cure when subjected to an effective amount of actinic radiation; and
a secondary component comprising a first secondary precursor species isolated from a second secondary precursor species, the first secondary precursor species and the second secondary precursor species configured to react when subjected to an initiating event.

2. A dual-cure resin as in claim 1 , wherein the first secondary precursor species is physically isolated from the second secondary precursor species.

3. A dual-cure resin as in claim 1 , wherein the first secondary precursor species is insoluble with the second secondary precursor species at room temperature.

4. A dual-cure resin as in claim 1 , wherein the first secondary precursor species comprises a blocking agent configured to prevent reaction of the first secondary precursor species and the second secondary precursor species, until occurrence of the initiating event.

5. A dual-cure resin as in claim 1 , wherein the second secondary precursor species comprises dicyandiamide.

6. A dual-cure resin as in claim 1 , wherein isolation prevents reaction between the first secondary precursor species and the second secondary precursor species, until subjected to the initiating event.

7. A dual-cure resin for use in additive manufacturing, comprising:
a photo-curable component configured to cure when subjected to an effective amount of actinic radiation; and
a secondary component comprising dicyandiamide and a secondary precursor species configured to react with dicyandiamide when subject to an initiating event.

8. A dual-cure resin for use in additive manufacturing, comprising:
a photo-curable component configured to cure when subjected to an effective amount of actinic radiation; and
a secondary component comprising a plurality of particles comprising a first secondary precursor species, wherein the plurality of particles are configured to dissolve when subjected to a dissolving event.

9. The dual-cure resin of claim 8 , wherein the dissolving event comprises application of an effective amount of heat.

10. The dual-cure resin of claim 8 , wherein the dissolving event comprises application of an effective mechanical force.

11. The dual-cure resin of claim 10 , wherein the effective mechanical force comprises a vibrational force.

12. The dual-cure resin of claim 8 , wherein the dissolving event comprises introduction of a chemical species.

13. The dual-cure resin of claim 12 , wherein the chemical species comprises at least one of a solvent or a catalyst.

14. The dual-cure resin of claim 8 , wherein the plurality of particles are configured to remain substantially undissolved until subjected to the dissolving event.

15. The dual-cure resin of claim 8 , wherein the secondary component is configured to produce a secondary polymer comprising one of a polyurea or an epoxy.

16. The dual-cure resin of any of claim 8 , wherein the first secondary precursor species comprises an amine species.

17. The dual-cure resin of claim 16 , wherein the amine species comprises dicyandiamide.

18. The dual-cure resin of claim 8 , wherein the secondary component further comprises a second secondary precursor species configured to react with the dissolved first secondary species to produce a secondary polymer.

19. The dual-cure resin of claim 18 , wherein the second secondary precursor species comprises a diisocyanate species.

20. The dual-cure resin of any of claim 8 , wherein the dual-cure resin is configured to have a shelf-life of at least six months.

21. The dual-cure resin of any of claim 8 , wherein the dual-cure resin is configured to have a viscosity of between 1 cP and 10,000 cP at 30° C.

Assignees

• Formlabs Inc

Inventors

• Arndt Eric
• Lyon Gayla
• Zguris Zachary

Classifications

• B33Y70/00 Primary

  Materials specially adapted for additive manufacturing · CPC title

• C08G18/3838

  containing cyano groups · CPC title

• C08G18/3206

  aliphatic · CPC title

• C08G18/4854

  Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group · CPC title

• C08G18/10

  Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step · CPC title