Flux recovery device, soldering device and method for removing flux

Patent metadata

Field	Value
Publication number	US-10792607-B2
Application number	US-202016807390-A
Country	US
Kind code	B2
Filing date	Mar 3, 2020
Priority date	Mar 8, 2019
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

To provide a flux recovery device which can remove a flux in a pipe and a method for removing a flux. A flux recovery device 200 according to the present invention recovers a flux from a gaseous mixture containing a flux component, the flux recovery device 200 including: a separation unit 400 configured to separate the flux from the gaseous mixture using water, and to discharge the water containing the flux; a pipe 500 including a second connection port 540 , an inclined portion 580 , and a first connection port 520 , the water containing the flux flowing into the pipe 500 from the second connection port 540 , the inclined portion 580 being positioned on a downstream side of the second connection port 540 , and extending in a direction intersecting with a vertical line extending in a gravity direction, and the first connection port 520 being positioned on an upstream side of the inclined portion 580 ; and a pump 220 configured to supply water from the first connection port 520.

First claim

What is claimed is:

1. A flux recovery device which recovers a flux from a gaseous mixture containing a flux component, the flux recovery device comprising:
a separation unit configured to separate the flux from the gaseous mixture using water, and to discharge the water containing the flux;
a pipe including a second connection port, an inclined portion, and a first connection port, the water containing the flux flowing into the pipe from the second connection port, the inclined portion being positioned on a downstream side of the second connection port, and extending in a direction intersecting with a vertical line extending in a gravity direction, and the first connection port being positioned on an upstream side of the inclined portion; and
a pump configured to supply water from the first connection port.

2. The flux recovery device according to claim 1 , wherein
a pressure of the water supplied from the first connection port by the pump is higher than a pressure of the water containing the flux and flowing into the pipe from the second connection port.

3. The flux recovery device according to claim 1 , wherein
a pressure difference between the pressure of the water supplied from the first connection port by the pump and a pressure on a downstream side of the inclined portion is 0.1 MPa or more.

4. The flux recovery device according to claim 1 , wherein
the inclined portion includes a straight pipe portion which extends straight,
a portion of the pipe between a position where the first connection port is formed and a downstream end portion of the straight pipe portion extends straight, and
the water supplied from the pump is injected toward the straight pipe portion.

5. The flux recovery device according to claim 1 , wherein
the pump supplies the water also to the separation unit.

6. The flux recovery device according to claim 5 , further comprising a purifying device to which water containing the flux and discharged from the separation unit is supplied, and which is configured to separate the flux from the water containing the flux to recover the flux, wherein
the pump supplies, to the first connection port and the separation unit, water separated from the water containing the flux by the purifying device.

7. The flux recovery device according to claim 1 , further comprising a control unit configured to control supply of the water supplied to the first connection port by the pump.

8. The flux recovery device according to claim 7 , wherein
the control unit controls the supply of the water at predetermined time intervals.

9. A soldering device comprising:
a solder processing unit; and
the flux recovery device described in claim 1 and configured to recover a flux from a gaseous mixture containing a flux component and generated in the solder processing unit.

Assignees

• Senju Metal Industry Co

Inventors

• Hiyama Tsutomu

Classifications

• B01D47/02 Primary

  by passing the gas or air or vapour over or through a liquid bath · CPC title

• B23K3/00

  Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods · CPC title

• B23K2101/42

  Printed circuits · CPC title

• B01D53/002 Primary

  by condensation · CPC title

• B23K3/08 Primary

  Auxiliary devices therefor · CPC title